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2450BM15A0002E PDF预览

2450BM15A0002E

更新时间: 2024-11-28 12:26:51
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约翰逊 - JOHANSON /
页数 文件大小 规格书
2页 178K
描述
High Frequency Ceramic Solutions

2450BM15A0002E 数据手册

 浏览型号2450BM15A0002E的Datasheet PDF文件第2页 
High Frequency Ceramic Solutions  
P/N 2450BM15A0002  
Page 1 of 2  
2.45 GHz Impedance Matched Balun-BPF: For TI CC253X, CC254X, CC257X,  
CC853X and CC852X Chipset family  
4/29/2013  
Detail Specification:  
12 min. @ 1GHz  
General Specifications  
Part Number  
Differential Mode  
Attenuation (dB)  
-40°C to 125°C  
2450BM15A0002  
2400 - 2500  
50  
18 min. @ 4800~5000MHz  
20 min. @ 7200~7500MHz  
180° ± 15  
Frequency (MHz)  
Unbalanced Impedance  
Phase Diff. (-40°C to 125°C)  
Input Power  
Impedance match to T.I. CC253X,  
CC254X, CC257X, CC853X and CC852X  
Chipsets  
2W max.  
Balanced Differential  
Impedance  
4,000  
Reel Quanity  
Insertion Loss  
1.5 dB max. (-40°C to +85°C)  
1.7 dB max. (-40°C to +125°C)  
9.5 dB min.  
-40°C to +125°C  
Operating Temperature  
Insertion Loss  
+5 ~ +35 °C, Humidity  
45~75%RH, 18 mos. max  
Recommended Storage  
Conditions  
Return Loss (-40°C to 125°C)  
Part Number Explanation  
Bulk  
Suffix = S  
Suffix = E  
Eg. 2450BM15A0002S  
Eg. 2450BM15A0002E  
Packaging  
Style  
T & R  
Terminal Configuration  
P/N  
Suffix  
Termination Style  
Function  
Unbalanced Port  
GND  
No.  
100% Tin  
Suffix = None Eg. 2450BM15A0002(E or S)  
2450BM15A0002-EBSMA  
Evaluation Board  
1
2
Balanced Port  
Balanced Port  
GND  
3
Mechanical Dimensions  
In  
mm  
±
4
0.079  
0.049  
0.028  
0.012  
0.008  
0.004  
0.004  
0.004  
0.004  
0.004  
2.00  
1.25  
0.70  
0.30  
0.20  
0.10  
L
W
T
a
±
±
±
±
±
5
W
0.10  
0.10  
0.10  
0.10  
GND  
±
6
±
L
c
±
a
p
b
c
±
0.012 +.004/-.008  
0.30 +0.1/-0.2  
T
0.014  
0.026  
0.004  
0.002  
0.35  
0.65  
0.10  
0.05  
g
p
±
±
±
±
g
b
Mounting Considerations  
Mount these devices with brown mark facing up. Units: mm  
*
Line width should be designed to provide 50 impedance matching characteristics.  
0.35  
Note: No DC  
Blocking Capacitor  
required (internal)  
Solder Resist  
*
0.8  
Land  
    
T.I. Chipset  
Through-hole (0.3)  
1.0  
    
0.30  
Johanson Technology, Inc. reserves the right to make design changes without notice.  
All sales are subject to Johanson Technology, Inc. terms and conditions.  
www.johansontechnology.com  
4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821  
2013 Johanson Technology, Inc. All Rights Reserved  
Ver 1.2  

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