High Frequency Ceramic Solutions
2.45 GHz Balun / Matching Network : Optimized for TI Chipset CC2520
3/7/2013
P/N 2450BM15B0002
Page 1 of 3
Detail Specification:
12 min. @ 1GHz
General Specifications
Part Number
Differential Mode Attenuation
(dB)
-40°C to 125°C
2450BM15B0002
2400 - 2500
50 Ω
18 min. @ 4800~5000MHz
20 min. @ 7200~7500MHz
180° ± 15
Frequency (MHz)
Unbalanced Impedance
Phase Diff. (-40°C to 125°C)
Input Power
2W max.
Differential Balanced
Impedance
Conjugate match to
TI Chipset 2520
4,000
Reel Quanity
1.5 dB max. (-40°C to +85°C)
1.7 dB max. (-40°C to +125°C)
9.5 dB min.
-40°C to +125°C
Insertion Loss
Operating Temperature
Insertion Loss
Storage Temperature
Range
+5 ~ +35 °C, Humidity
45~75%RH, 12 mos. max
Return Loss (-40°C to 125°C)
Part Number Explanation
Eg. 2450BM15B0002S
Bulk
Suffix = S
Packaging
Style
Eg. 2450BM15B0002E
T & R
Suffix = E
Terminal Configuration
P/N
Suffix
Eg. 2450BM15B0002(E or S)
No.
Function
100% Tin
Tin / Lead
Suffix = None
Termination
Style
Please consult Factory
Unbalanced Port
(2.2nH Ind)*
1
GND
Balanced Port
Balanced Port
GND
2
3
4
5
6
Mechanical Dimensions
In
mm
±
0.079
0.049
0.028
0.012
0.008
0.004
0.004
0.004
0.004
0.004
2.00
1.25
0.70
0.30
0.20
0.10
L
W
T
a
±
±
±
±
±
W
c
0.10
0.10
0.10
0.10
±
GND
±
L
±
a
p
3
4
2
1
b
c
±
0.012 +.004/-.008
0.30 +0.1/-0.2
T
0.014
0.004
0.002
0.35
0.65
0.10
g
p
±
±
±
±
g
b
0.026
0.05
5
6
*2.2 nH Ceramic Chip inductor required on unbalanced port. See page 2 for details
Mounting Considerations
0.35
Mount these devices with brown mark facing up. Units: mm
* Line width should be designed to provide 50 Ω
*
impedance matching characteristics.
3 2 1
4 5 6
Solder Resist
T.I. Chipset
0.8
1.0
Note: No DC
Blocking Capacitor
required (internal)
Land
Through-hole (φ0.3)
0.30
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