Datasheet > 243-1PAB

243-1PAB

更新时间： 2024-11-20 12:55:51

品牌	Logo	应用领域
其他 - ETC		散热片半导体
页数	文件大小	规格书
20页	922K
描述
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

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中文翻译

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数据手册

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243-1PAB 数据手册

Board Level

Heat Sinks

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

D²PAK, TO-220, SOT-223, SOL-20

217 SERIES

Surface Mount Heat Sinks

Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a

variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

component thermal specifications.

FEATURES AND BENEFITS:

•

No interface material is needed

Copper with tin-lead plating for improved solderability and assembly

Both the component and the heat sink are installed on the PC-board utilizing

standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats

EIA standards and ESD protection are specified

•

Can be used with water soluble or no clean SMT solder creams or other pastes

Height Above

PC Board

in. (mm)

Footprint

Dimensions

in. (mm)

Thermal Performance at Typical Load

Standard

P/N

Package

Format

Package

Quantity

Natural

Forced

Convection)

Convection

217-36CT6 ̆

217-36CTT6

217-36CTR6̆

.390 (9.9)

.600 (15.2) x .740 (18.8)

Bulk

Tube

Tape & Reel

250

55°C @ 1W

16.0°C/W @ 200 LFM

Material: Copper, Tin, Lead Plated

MECHANICAL DIMENSIONS

217 HEAT SINK WITH

DDPAK DEVICE

THERMAL PERFORMANCE

6 LAYER BOARD, D' PAK

125°C LEAD, 40°C AMBIENT

217-36CT6

Device Power Dissipation. W

KEY:

í Device only, NC v Device + HS, NC ̆ Device + HS, 100 lfm Device + HS, 200 lfm ȣ Device + HS, 300 lfm

SECTION A-A

NOTES

TAPE DETAILS

1. Material to be “ESD”

2. Approximately 6 Meters per Reel

3. 250 Pieces per Reel.

217-36CTR6

REEL DETAILS

Dimensions: in.

All other products, please contact factory for price, delivery, and minimums.

̆ Normally stocked

12 3 4 5 6 7...20

中文翻译

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