Datasheet > 243-1PAB

243-1PAB

更新时间： 2022-06-13 22:14:30

品牌	Logo	应用领域
其他 - ETC		散热片半导体
页数	文件大小	规格书
20页	922K
描述
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

243-1PAB 数据手册

Board Level

Heat Sinks

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

601 AND 603 SERIES

Low-Height Heat Sinks

DO-4/DO-5 Diodes

Footprint

Dimensions

in. (mm)

Mounting

Hole Dia.

in. (mm)

Thermal Performance at Typical Load

Standard

P/N

Height

in. (mm)

Natural

Forced

Convection

Weight

lbs. (grams)

Convection

601E

601F

601K

603K

2.000 (50.8) x 1.250 (31.8)

2.000 (50.8) x 2.000 (50.8)

0.562 (14.3)

0.200 (5.1)

0.270 (6.9)

None

52°C @ 5.0W

41°C @ 5.0W

4.5°C/W @ 175 LFM

4.0°C/W @ 175 LFM

0.0500 (22.68)

0.0810 (36.74)

None

Material: Aluminum Alloy, Black Anodized

Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-

conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient

heat dissipation are required. The 601 and 603 Series may also be attached to enclosure pan-

els or brackets using isolation hardware where necessary.

MECHANICAL DIMENSIONS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

603 SERIES

(EXTRUSION PROFILE 1284)

601 SERIES

(EXTRUSION PROFILE 1284)

SEMICONDUCTOR MOUNTING HOLES

Dimensions: in. (mm)

635 SERIES

Space-Saving Low-Cost Heat Sinks

TO-3

Height Above

PC Board “A”

in. (mm)

Outline

Dimensions

in. (mm)

Thermal Performance at Typical Load Semiconductor

Standard

P/N

Natural

Forced

Convection

Mounting

Hole Pattern

Weight

lbs. (grams)

Convection

635-5B2

0.500 (12.7)

0.750 (19.1)

1.000 (25.4)

1.250 (31.8)

1.900 (48.3) x 1.420 (36.0)

90°C @ 8.0W

77°C @ 8.0W

61°C @ 8.0W

53°C @ 8.0W

6.0°C/W @ 300 LFM

4.8°C/W @ 300 LFM

3.6°C/W @ 300 LFM

3.1°C/W @ 300 LFM

TO-3

T0-3

0.0200 (9.07)

0.0220 (9.98)

0.024 (10.89)

0.028 (12.70)

635-75B2

635-10B2

635-125B2

Material: Aluminum Alloy, Black Anodized

Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed cir-

cuit board, where two or more TO-3s must be placed in proximity and minimum space is

available for heat sinking. Four different heights are available, all with TO-3 mounting hole

pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns.

MECHANICAL DIMENSIONS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

635 SERIES

Dimensions: in. (mm)

All other products, please contact factory for price, delivery, and minimums.

̆ Normally stocked

1...17 18 1920

下载PDF

与243-1PAB相关器件

型号	品牌	描述	获取价格	数据表
2432	FRONTIER	Insert Molded Coil	获取价格
2432	PULSE	SWITCH-MODE TRANSFORMER GUIDE BY TECHNOLOGY	获取价格
2432-002-X5R0-101M	CTS	Feed Through Capacitor, 1 Function(s), 1000V, 20A,	获取价格
2432-002-X5S0-471M	CTS	Feed Through Capacitor, 1 Function(s), 1000V, 20A,	获取价格
2432-002-X5U0-502M	CTS	2432-002-X5U0-502M	获取价格
2432-002-X5W0-752Z	CTS	Feed Through Capacitor, 1 Function(s), 1000V, 20A,	获取价格