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2305NZ-1HDCGI8 PDF预览

2305NZ-1HDCGI8

更新时间: 2024-11-25 01:05:27
品牌 Logo 应用领域
艾迪悌 - IDT PC驱动光电二极管输出元件逻辑集成电路
页数 文件大小 规格书
6页 112K
描述
FIVE OUTPUT 3.3V CLOCK BUFFER

2305NZ-1HDCGI8 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:SOIC
包装说明:SOIC-8针数:8
Reach Compliance Code:compliant风险等级:5.7
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:762305Samacsys Pin Count:8
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:DC/DCG8Samacsys Released Date:2020-01-14 10:35:10
Is Samacsys:N系列:2305
输入调节:STANDARDJESD-30 代码:R-PDSO-G8
JESD-609代码:e3长度:4.9 mm
逻辑集成电路类型:PLL BASED CLOCK DRIVER最大I(ol):0.012 A
湿度敏感等级:1功能数量:1
反相输出次数:端子数量:8
实输出次数:5最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:LSOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, LOW PROFILE
峰值回流温度(摄氏度):260电源:3.3 V
传播延迟(tpd):8.7 ns认证状态:Not Qualified
Same Edge Skew-Max(tskwd):0.25 ns座面最大高度:1.55 mm
子类别:Clock Drivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:3.9 mm
Base Number Matches:1

2305NZ-1HDCGI8 数据手册

 浏览型号2305NZ-1HDCGI8的Datasheet PDF文件第2页浏览型号2305NZ-1HDCGI8的Datasheet PDF文件第3页浏览型号2305NZ-1HDCGI8的Datasheet PDF文件第4页浏览型号2305NZ-1HDCGI8的Datasheet PDF文件第5页浏览型号2305NZ-1HDCGI8的Datasheet PDF文件第6页 
IDT2305NZ  
FIVE OUTPUT  
3.3V CLOCK BUFFER  
FEATURES:  
DESCRIPTION:  
• One input to five output buffer/driver  
• Low power consumption for mobile applications: less than  
32mA at 66.6MHz with unloaded outputs  
• 8.7ns max input-output delay  
• Buffers all frequencies from DC to 133.33MHz  
• Output-output skew < 250ps  
TheIDT2305NZisalow-costbufferdesignedtodistributehigh-speed  
clocks in mobile PC systems and desktop PC systems. The IDT2305NZ  
operates at 3.3V with five outputs that can run up to 133.33MHz  
The IDT2305NZ is an 8-pin version of the IDT2309NZ. It is designed  
for low EMI and power optimization and consumes less than 32mA at  
66.6MHz,makingitidealforthelowpowerrequirementsofmobilesystems.  
• 3.3V operation  
• High drive capability  
• Available in SOIC package  
FUNCTIONALBLOCKDIAGRAM  
BUF_IN  
OUTPUT1  
OUTPUT2  
OUTPUT3  
OUTPUT4  
OUTPUT5  
TheIDTlogoisaregisteredtrademarkofIntegratedDeviceTechnology,Inc.  
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES  
FEB. 2017  
1
c
2017Integrated Device Technology, Inc.  
DSC 6592/5  

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