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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 221-3679 | COOPER |
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HEADER CONNECTOR,CABLE MNT,RECEPT,79 CONTACTS,PIN,0.05 PITCH |
|
| 2213699-1 | TE |
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THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 2213699-2 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 2213699-3 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 2213699-4 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 22137 | SCHOTT |
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XFMR RECEIVE, T1/CEPT |
|
| 2213-75SL | JDSU |
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Air-Cooled Argon-Ion Laser Heads in Cylindrical Package |
|
| 2213795-1 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 2213795-2 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 2213800-1 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
联发科推出全球首款3纳米汽车芯片CT-X1，挑战高通SA8295
国家大基金减持三家半导体企业，市场反应各异
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