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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 22-11-2272 | MOLEX |
获取价格 |
Board Connector, 27 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 22-11-2276 | MOLEX |
获取价格 |
Board Connector, 27 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 22-11-2286 | MOLEX |
获取价格 |
Board Connector, 28 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 221-1248 | COOPER |
获取价格 |
Board Connector, 48 Contact(s), 1 Row(s), Male, 0.1 inch Pitch, Receptacle |
|
| 2211-250D | DATADELAY |
获取价格 |
FIXED DIP DELAY LINE TD/TR = 10 |
|
| 2211-300B | DATADELAY |
获取价格 |
FIXED DIP DELAY LINE TD/TR = 10 |
|
| 2211-300C | DATADELAY |
获取价格 |
FIXED DIP DELAY LINE TD/TR = 10 |
|
| 2211-300D | DATADELAY |
获取价格 |
FIXED DIP DELAY LINE TD/TR = 10 |
|
| 2211-300G | DATADELAY |
获取价格 |
FIXED DIP DELAY LINE TD/TR = 10 |
|
| 2211-30SL | JDSU |
获取价格 |
Air-Cooled Argon-Ion Laser Heads in Cylindrical and Rectangular Packages |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
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