5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 22-10-2031 | MOLEX |
获取价格 |
2.54mm (.100) Pitch KK® Wire-to-Board Header, |
|
| 22-10-2041 | MOLEX |
获取价格 |
2.54mm (.100) Pitch KK® Wire-to-Board Header, |
|
| 22-10-2048 | MOLEX |
获取价格 |
Board Connector, 4 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, |
|
| 22-10-2051 | MOLEX |
获取价格 |
2.54mm (.100) Pitch KK® Wire-to-Board Header, |
|
| 22-10-2054 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, |
|
| 22-10-2061 | MOLEX |
获取价格 |
2.54mm (.100) Pitch KK® Wire-to-Board Header, |
|
| 22-10-2064 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, |
|
| 22-10-2068 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, |
|
| 22-10-2071 | MOLEX |
获取价格 |
2.54mm (.100) Pitch KK? Wire-to-Board Header, Single Row, Vertical, 7 Circuits, PA Polyami |
|
| 22-10-2072 | MOLEX |
获取价格 |
Board Connector, 7 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
