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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 2113022-2 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-3 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-4 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-5 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-6 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-7 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-8 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113022-9 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2113-1-00-44-00-00-07-0 | MILL-MAX |
获取价格 |
PCB Terminal, ROHS COMPLIANT |
|
| 2113-1-00-44-7 | MILL-MAX |
获取价格 |
PCB Terminal |
|
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
联发科推出全球首款3纳米汽车芯片CT-X1，挑战高通SA8295
国家大基金减持三家半导体企业，市场反应各异
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