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1SMB5949 PDF预览

1SMB5949

更新时间: 2024-10-30 05:01:59
品牌 Logo 应用领域
TSC 稳压二极管测试
页数 文件大小 规格书
4页 85K
描述
3.0 Watts Surface Mount Silicon Zener Diode

1SMB5949 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.52Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODEJEDEC-95代码:DO-214AA
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性:UNIDIRECTIONAL
最大功率耗散:0.55 W认证状态:Not Qualified
标称参考电压:100 V表面贴装:YES
技术:ZENER端子面层:Tin (Sn)
端子形式:C BEND端子位置:DUAL
最大电压容差:5%工作测试电流:3.7 mA
Base Number Matches:1

1SMB5949 数据手册

 浏览型号1SMB5949的Datasheet PDF文件第2页浏览型号1SMB5949的Datasheet PDF文件第3页浏览型号1SMB5949的Datasheet PDF文件第4页 
DATA SHEET  
1SMB5926~1SMB5939  
GLASS PASSIVATED JUNCTION SILICON ZENER DIODES  
Unit: inch (mm)  
SMB/DO-214AA  
1.5 Watts  
VOLTAGE  
FEATURES  
POWER  
11 to 39 Volts  
• Low profile package  
• Built-in strain relief  
• Low inductance  
• Plastic package has Underwriters Laboratory Flammability  
Classification 94V-O  
• Both normal and Pb free product are available :  
Normal : 80~95% Sn, 5~20% Pb  
.185(4.70)  
.160(4.06)  
Pb free: 99% Sn above can meet Rohs environment substance  
directive request  
.012(.305)  
.006(.152)  
MECHANICALDATA  
Case: JEDEC DO-214AA, Molded plastic over passivated junction  
Terminals: Solder plated, solderable per MIL-STD-202G, Method 208  
.050(1.27)  
.030(0.76)  
.008(.203)  
.002(.051)  
Polarity: Indicated by cathode band  
Standard packaging: 12mm tape (EIA-481)  
Weight: 0.003 ounce, 0.093 gram  
.220(5.59)  
.200(5.08)  
MAXIMUMRATINGSANDELECTRICALCHARACTERISTICS  
Ratings at 25°C ambient temperature unless otherwise specified.  
Param eter  
Sym bol  
Value  
Units  
W atts  
O C  
D C PowerD issipation on TA  
=75 O C ,M easure atZero Lead Length  
1.5  
P
D
D erate above 75O C (NO TE 1)  
O perating Junction and StorageTem perature Range  
-55 to +150  
TJ ,TSTG  
NOTES:  
1.Mounted on 5.0mm2 (.013mm thick) land areas.  
STAD-NOV.05.2004  
PAGE . 1  

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