1SMB5913BT3 Series
Preferred Device
3 Watt Plastic Surface Mount
Zener Voltage Regulators
This complete new line of 3 Watt Zener diodes offers the following
advantages.
Specification Features
http://onsemi.com
• Zener Voltage Range − 3.3 V to 200 V
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Flat Handling Surface for Accurate Placement
• Package Design for Top Side or Bottom Circuit Board Mounting
• Pb−Free Packages are Available
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
Mechanical Characteristics
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
Cathode
Anode
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
SMB
CASE 403A
PLASTIC
MAXIMUM RATINGS
MARKING DIAGRAM
Rating
Symbol Value
Unit
Maximum Steady State Power
Dissipation @ T = 75°C
Measured at Zero Lead Length
P
D
3.0
W
YWW
9xxB
L
Derate Above 75°C
40
25
mW/°C
°C/W
R
q
JL
Thermal Resistance from Junction−to−Lead
Y
= Year
WW
= Work Week
Maximum Steady State Power Dissipation
P
D
550
mW
9xxB
= Specific Device Code
= (See Table page 3)
@ T = 25°C (Note )
Derate Above 25°C
Thermal Resistance from Junction−to−Ambient
A
4.4
226
mW/°C
°C/W
R
q
JA
Operating and Storage
Temperature Range
T , T
−65
to
°C
J
stg
ORDERING INFORMATION
+150
†
Device
Package
Shipping
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1SMB59xxBT3
SMB
2500/Tape & Reel
2500/Tape & Reel
1SMB59xxBT3G
SMB
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. FR−4 board, within 1″ to device, using recommended footprint.
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
September, 2004 − Rev. 4
1SMB5913BT3/D