1SMB5913BT3 Series
Preferred Device
3 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 3 Watt Zener diodes offers the following
advantages.
http://onsemi.com
Features
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
• Zener Voltage Range − 3.3 V to 200 V
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Flat Handling Surface for Accurate Placement
• Package Design for Top Side or Bottom Circuit Board Mounting
• Pb−Free Packages are Available
Mechanical Characteristics:
Cathode
Anode
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
SMB
CASE 403A
PLASTIC
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MARKING DIAGRAM
MAXIMUM RATINGS
AYWW
9xxB G
G
Rating
Symbol Value
Unit
Maximum Steady State Power
Dissipation @ T = 75°C
Measured at Zero Lead Length
Derate Above 75°C
P
3.0
W
L
D
A
Y
= Assembly Location
= Year
WW = Work Week
40
25
mW/°C
°C/W
R
q
JL
Thermal Resistance from Junction−to−Lead
9xxB = Device Code (Refer to page 3)
Maximum Steady State Power Dissipation
P
550
mW
D
G
= Pb−Free Package
(Note: Microdot may be in either location)
@ T = 25°C (Note )
Derate Above 25°C
Thermal Resistance from Junction−to−Ambient
A
4.4
226
mW/°C
°C/W
R
q
JA
ORDERING INFORMATION
Operating and Storage Temperature Range
T , T
−65 to
+150
°C
J
stg
†
Device
Package
Shipping
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 board, using recommended footprint.
1SMB59xxBT3
SMB
2500/Tape & Reel
2500/Tape & Reel
1SMB59xxBT3G
SMB
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
July, 2006 − Rev. 6
1SMB5913BT3/D