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1PMT4627E3 PDF预览

1PMT4627E3

更新时间： 2024-11-13 06:18:51
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管齐纳二极管
页数 文件大小 规格书
4页 113K
描述
POWERMITETM Low Noise 1 Watt Zener Diodes

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中文翻译

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1PMT4627E3 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：DO-216
包装说明：S-PDSO-G1针数：2
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.69
外壳连接：CATHODE配置：SINGLE
二极管元件材料：SILICON二极管类型：ZENER DIODE
JEDEC-95代码：DO-216AAJESD-30 代码：S-PDSO-G1
JESD-609代码：e3湿度敏感等级：1
元件数量：1端子数量：1
最高工作温度：150 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装形状：SQUARE
封装形式：SMALL OUTLINE极性：UNIDIRECTIONAL
最大功率耗散：0.5 W标称参考电压：6.2 V
表面贴装：YES技术：ZENER
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子位置：DUAL最大电压容差：5%
工作测试电流：0.25 mA

1PMT4627E3 数据手册

 浏览型号1PMT4627E3的Datasheet PDF文件第2页浏览型号1PMT4627E3的Datasheet PDF文件第3页浏览型号1PMT4627E3的Datasheet PDF文件第4页 
1PMT4614e3 thru 1PMT4627e3,  
1PMT4099e3 thru 1PMT4135e3  
POWERMITETM  
Low Noise 1 Watt Zener Diodes  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This Microsemi Powermite® surface mount low noise Zener package series  
provides a higher power handling capability that are also RoHS compliant.  
In addition to its size advantages, Powermite® package features include a  
full-metallic bottom that eliminates the possibility of solder flux entrapment  
during assembly, and a unique locking tab acts as an efficient heat path  
from die to mounting plane for external heat sinking with very low thermal  
resistance junction to case (bottom). Its innovative design makes this  
DO-216  
device ideal for use with automatic insertion equipment.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
•
Surface mount equivalent to JEDEC registered  
1N4099 thru 1N4135 and 1N4614 thru 1N4627  
series except with additional power capability  
•
•
Tight tolerances available in plus or minus 2% or 1%  
with C or D suffix respectively  
Moisture classification Level 1 per IPC/JEDEC  
J-STD-020B with no dry pack required  
•
Extensive selection from 1.8 to 100 V  
•
Regulates voltage over a broad operating current and  
temperature range  
•
•
Nonsensitive to ESD per MIL-STD-750 Method 1020  
Compatible with automatic insertion equipment  
•
•
•
Low noise density (1-3 kHz) at test current  
Low reverse leakage current  
RoHS compliant  
•
Full metallic bottom eliminates flux entrapment  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
•
•
Operating and Storage Temperatures: -55°C to +150°C  
•
•
CASE: Void-free transfer molded thermosetting epoxy  
compound meeting UL94V-0  
FINISH: Annealed matte-Tin plating over copper and  
readily solderable per MIL-STD-750 method 2026  
(consult factory for Tin-Lead plating)  
POLARITY: Cathode designated by Tab 1 (bottom)  
MARKING: Three numerical digits of P/N and a dot  
(see next page listing)  
WEIGHT: 0.016 grams (approx.)  
Package dimensions on last page  
Tape & Reel option: Standard per EIA-481-B  
3000 on 7 inch reel and 12,000 on 13” reel  
Steady-State Power: 1.0 watt at TC < 120oC where  
TC is case bottom temperature at mounting plane, or  
0.5 watts at TA = 30ºC (ambient temperature) when  
mounted on FR4 PC board as described for thermal  
resistance (also see power deratings in Figure 1)  
•
•
•
Thermal Resistance: 30°C/W junction to case  
(bottom) and 240°C/W junction to ambient on FR4  
PC board (1 oz copper) with recommended footprint  
(see last page)  
•
•
•
•
•
Forward voltage: 1.1 Volts @ 200 mA  
Solder Temperatures: 260°C for 10 s (max)  
Copyright © 2007  
10-15-2007 REV J  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1234

中文翻译

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