1N5807US thru 1N5811US
SURFACE MOUNT VOIDLESS-
HERMETICALLY-SEALED ULTRA FAST
RECOVERY GLASS RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This “Ultrafast Recovery” surface mount rectifier diode series is military qualified to
MIL-PRF-19500/477 and is ideal for high-reliability applications where a failure
cannot be tolerated. These industry-recognized 6.0 Amp rated rectifiers for working
peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless-
glass construction using an internal “Category I” metallurgical bond. These devices
are also available in axial-leaded package configurations (see separate data sheet
for 1N5807 thru 1N5811). Microsemi also offers numerous other rectifier products
to meet higher and lower current ratings with various recovery time speed
requirements including standard, fast, and ultrafast device types in both through-
hole and surface mount packages.
Package “E”
or D-5B
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Surface mount package series equivalent to the
•
Ultrafast recovery 6 Amp rectifiers series 50 to 150 V
JEDEC registered 1N5807 to 1N5811 series
•
•
Military and other high-reliability applications
Switching power supplies or other applications
requiring extremely fast switching & low forward loss
High forward surge current capability
•
•
Voidless-hermetically-sealed glass package
Extremely robust construction
Triple-layer passivation
•
•
•
•
•
Low thermal resistance
Internal “Category I” Metallurgical bonds
•
Controlled avalanche with peak reverse power
JAN, JANTX, JANTXV, and JANS available per MIL-
capability
PRF-19500/477
•
Inherently radiation hard as described in Microsemi
MicroNote 050
•
Axial-leaded equivalents also available (see separate
data sheet for 1N5807 thru 1N5811)
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
•
Operating Temperature: -65oC to +175oC.
•
•
CASE: Hermetically sealed voidless hard glass
Storage Temperature: -65oC to +175oC.
with Tungsten slugs
TERMINALS: End caps are solid Silver with
Tin/Lead (Sn/Pb) finish
MARKING & POLARITY: Cathode band only
Tape & Reel option: Standard per EIA-481-B
Weight: 539 mg
Average Rectified Forward Current (IO): 6 Amps @
T
EC = 75ºC End Cap temperature (see note 1)
•
•
•
Thermal Resistance: 10 ºC/W junction to end cap
Thermal Impedance: 1.5 ºC/W @ 10 ms heating time
Forward Surge Current (8.3 ms half sine) 125 Amps
•
•
•
•
•
Solder temperature: 260ºC for 10 s (maximum)
See package dimensions and recommended pad
layout on last page
ELECTRICAL CHARACTERISTICS
WORKING BREAKDOWN
AVERAGE
AVERAGE
MAXIMUM
FORWARD
VOLTAGE
@ 4 A
REVERSE
CURRENT
(MAX)
SURGE
CURRENT
(MAX)
REVERSE
RECOVERY
TIME (MAX)
(NOTE 4)
PEAK
VOLTAGE
(MIN.)
RECTIFIED RECTIFIED
REVERSE
VOLTAGE
CURRENT
CURRENT
TYPE
@ 100µA
I
I
@ V
I
FSM
O1
O2
RWM
(8.3 ms pulse)
VF
V
t
IR
(NOTE 3)
AMPS
V
@TA=55ºC
RWM
rr
BR
@T =75ºC
EC
(Note 2)
(Note 1)
AMPS
VOLTS
VOLTS
AMPS
VOLTS
ns
µA
25oC
100oC 25oC 100oC
1N5807US
1N5809US
1N5811US
50
60
6.0
6.0
6.0
3.0
3.0
3.0
0.875
0.800
0.800
0.800
5
5
5
150
150
150
125
125
125
30
30
30
100
110
160
0.875
0.875
150
NOTE 1: Rated at TEC = 75ºC. Derate at 60 mA/ºC for TEC above 75ºC
NOTE 2: Derate linearly at 25 mA/ºC above TA = 55ºC. This rating is typical for PC boards where thermal resistance from mounting point to
ambient is sufficiently controlled where TJ(max) does not exceed 175ºC
NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals
NOTE 4: I = 1.0 A, I
= 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/µs min
RM
F
Copyright 2004
1-14-2005 REV B
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503