1N5615 thru 1N5623
VOIDLESS-HERMETICALLY SEALED
FAST RECOVERY GLASS RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This “fast recovery” rectifier diode series is military qualified to MIL-PRF-19500/429
and is ideal for high-reliability applications where a failure cannot be tolerated.
These industry-recognized 1.0 Amp rated rectifiers for working peak reverse
voltages from 200 to 1000 volts are hermetically sealed with voidless-glass
construction using an internal “Category I” metallurgical bond. These devices are
also available in surface mount MELF package configurations by adding a “US”
suffix (see separate data sheet for 1N5615US thru 1N5623US). Microsemi also
offers numerous other rectifier products to meet higher and lower current ratings
with various recovery time speed requirements including fast and ultrafast device
types in both through-hole and surface mount packages.
“A” Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
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•
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Popular JEDEC registered 1N5615 to 1N5623 series
Voidless hermetically sealed glass package
Triple-Layer Passivation
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Fast recovery 1 Amp rectifiers 200 to 1000 V
Military and other high-reliability applications
General rectifier applications including bridges, half-
bridges, catch diodes, etc.
High forward surge current capability
Extremely robust construction
Internal “Category I” Metallurgical bonds
Working Peak Reverse Voltage 200 to 1000 Volts.
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JAN, JANTX, JANTXV, and JANS available per MIL-
PRF-19500/429
Low thermal resistance
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Controlled avalanche with peak reverse power
capability
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Surface mount equivalents also available in a square
end-cap MELF configuration with “US” suffix (see
separate data sheet for 1N5615US thru 1N5623US)
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Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
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Junction & Storage Temperature: -65oC to +175oC
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CASE: Hermetically sealed voidless hard glass with
Tungsten slugs (package dimensions on last page)
Thermal Resistance: 38oC/W junction to lead at 3/8
inch (10 mm) lead length from body
Thermal Impedance: 4.5oC/W @ 10 ms heating time
TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish. Note: Previous inventory
had solid Silver axial-leads and no finish.
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Average Rectified Forward Current (IO): 1.0 Amps @
TA = 55ºC
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MARKING: Body paint and part number, etc.
POLARITY: Cathode band
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Forward Surge Current: 30 Amps @ 8.3 ms half-sine
Solder Temperatures: 260ºC for 10 s (maximum)
TAPE & REEL option: Standard per EIA-296
WEIGHT: 340 mg
ELECTRICAL CHARACTERISTICS
WORKING
PEAK
MINIMUM
BREAKDOWN
VOLTAGE
AVERAGE
RECTIFIED
CURRENT
IO @ TA
FORWAR
D
VOLTAGE
(MAX.)
VF @ 3A
REVERSE
CURRENT
(MAX.)
CAPACITANCE MAXIMUM
REVERSE
RECOVERY
(MAX.)
(NOTE 3)
trr
(MAX.)
C @ VR =12 V
f=1 MHz
SURGE
CURRENT
IFSM
REVERSE
VOLTAGE
VRWM
TYPE
VBR @ 50μA
IR @ VRWM
(NOTE 1)
(NOTE 2)
AMPS
VOLTS
VOLTS
AMPS
VOLTS
pF
ns
μA
50oC 100oC
25oC 100oC
1N5615
1N5617
1N5619
1N5621
1N5623
200
400
600
800
1000
220
440
660
880
1100
1.00
1.00
1.00
1.00
1.00
.750
.750
.750
.750
.750
.8 MIN.
.5
.5
.5
.5
.5
25
25
25
25
25
45
35
25
20
15
25
25
25
25
25
150
150
250
300
500
1.6
MAX.
NOTE 1: From 1 Amp at TA = 55oC, derate linearly at 5.56 mA/ oC to 0.75 Amp at TA = 100oC. From TA = 100oC,
derate linearly at 7.5 mA/oC to 0 Amps at TA = 200 oC. These ambient ratings are for PC boards where thermal
resistance from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175 oC.
NOTE 2: TA = 100 oC, f = 60 Hz, IO = 750 mA for ten 8.3 ms surges @ 1 minute intervals
NOTE 3: IF = 0.5 A, IRM = 1 A, IR(REC) = 0.250 A
Copyright © 2007
1-15-2007 REV D
Microsemi
Scottsdale Division
Page 1
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503