1N4728UR-1 thru 1N4764AUR-1,e3
(or MLL4728A-1 thru MLL4764A-1,e3)
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.0 W ZENERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This surface mountable 1 watt Zener diode series is electrically equivalent to
the 1N4728A thru 1N4764A registration in the DO-41 equivalent package
except that it meets the JEDEC surface mount outline DO-213AB and also
includes enhanced internal contact design. It is an ideal selection for
applications of high density and low parasitic requirements for voltage
regulation. Standard voltage tolerance is +/-5% with tighter tolerances
available down to 1%. With its glass hermetic qualities, it may also be used
for high reliability applications when required by a source control drawing
(SCD).
DO-213AB
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
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Electrically similar to the JEDEC registered 1N4728
thru 1N4764 zener series
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Regulates voltage over a broad operating current
and temperature range
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Zener voltages available 3.3V to 100V
Metallurgically enhanced internal contact design fro
greater reliability and lower thermal resistance
Standard voltage tolerances are +/- 5% with “A” suffix
and 10 % with no suffix identification
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Wide selection from 3.3 to 100 V
Leadless package for surface mounting
Ideal for high density mounting
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Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard per MicroNote 050
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Surface mount equivalents also available as
SMAJ4728A to SMAJ4764A and SMAJ4728A to
SMAJ4764A
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RoHS Compliant devices available by adding “e3” suffix
Plastic body axial-leaded Zener equivalents are also
available as 1N4728A to 1N4764A
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
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Power dissipation at 25ºC: 1.0 watts (also see derating
in Figure 1).
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CASE: Hermetically sealed DO-213AB glass MELF
TERMINALS: Tin-Lead (Sn/Pb) or RohS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
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Operating and Storage temperature: -65ºC to +175ºC
Thermal Resistance: 40 ºC/W junction to end cap, or
120ºC/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page)
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POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
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Steady-State Power: 1.00 watts at TEC < 135oC, or
1.00 watts at TA < 55ºC when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
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MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
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Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260 ºC for 10 s (max)
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WEIGHT: 0.05 grams
See package dimensions & recommended mounting
pad on last page
Copyright © 2005
10-18-2005 REV A
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503