1N3643 thru 1N3647
1N4254 thru 1n4257
VOIDLESS-HERMETICALLY-SEALED
HIGH VOLTAGE RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
These “standard recovery” high voltage rectifier diode series are military qualified to
MIL-PRF-19500/279 for the 1N3644 thru 1N3647. Others such as the 1N5181 thru
1N5184 meet or exceed requirements of MIL-PRF-19500/389. They are ideal for
high-reliability where a failure cannot be tolerated for high voltage applications.
These 0.10 and 0.25 Amp rated rectifiers at 55ºC for working peak reverse voltages
from 1000 to 10,000 volts are hermetically sealed with voidless-glass construction
using an internal “Category I” metallurgical bond. Surface mount MELF package
configurations are also available by adding “SM” suffix. Microsemi also offers
numerous other rectifier products to meet higher and lower current ratings with
various recovery time speed requirements including fast and ultrafast device types
in both through-hole and surface mount packages.
S Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
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JEDEC registered 1N3643 thru 1N3647, 1N4254
thru 1N4257, and 1N5181 thru 1N5187 series
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High voltage standard recovery rectifiers 1000 to
10,000 V
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Voidless Hermetically Sealed Glass Package
Triple Layer Passivation
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Military and other high-reliability applications
Applications include bridges, half-bridges, catch
diodes, voltage multipliers, X-ray machines,
power supplies, transmitters, and radar
equipment
High forward surge current capability
Extremely robust construction
Low thermal resistance
Internal “Category I” Metallurgical bonds
Lowest Reverse Leakage Available
Lowest Thermal Resistance Available
Absolute High Voltage / High Temperature Stability
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1N5181 thru 1N5184 meet or exceed requirements
of MIL-S-19500/389
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Inherently radiation hard as described in Microsemi
MicroNote 050
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1N3644 thru 1N3647 JAN, JANTX types available
per MIL-S19500/279
Surface mount equivalents also available in a square
end-cap MELF configuration with “SM” suffix
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
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Junction & Storage Temperature: -65oC to +175oC
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CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
Thermal Resistance: 38oC/W junction to lead at 3/8
inch (10 mm) lead length from body
TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
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Average Rectified Forward Current (IO):
1N3643 thru 1N3647: 0.250 Amps @ TA = 55ºC
0.150 Amps @ TA = 100ºC
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MARKING: Body paint and part number, etc.
POLARITY: Cathode band
TAPE & REEL option: Standard per EIA-296
WEIGHT: 400 mg (approx)
1N4254 thru 1N4257: 0.250 Amps @ TA = 55ºC
0.150 Amps @ TA = 100ºC
See package dimensions on last page
1N5181 thru 1N5184: 0.100 Amps @ TA = 55ºC
0.060 Amps @ TA = 100ºC
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Forward Surge Current: See Electrical
Characteristics for surge at 8.3 ms half-sine wave
Solder Temperatures: 260ºC for 10 s (maximum)
Copyright © 2005
5-13-2005 REV B
Microsemi
Page 1
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