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1N4148W_11 PDF预览

1N4148W_11

更新时间: 2024-11-18 07:21:15
品牌 Logo 应用领域
美微科 - MCC 二极管开关
页数 文件大小 规格书
3页 168K
描述
High Speed Switching Diode 400mW

1N4148W_11 数据手册

 浏览型号1N4148W_11的Datasheet PDF文件第2页浏览型号1N4148W_11的Datasheet PDF文件第3页 
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
1N4148W  
Micro Commercial Components  
Features  
Fast switching speed  
Surface Mount Package Ideally Suited for Automatic Insertion  
For general purpose switching applications  
High Speed  
Switching Diode  
400mW  
High conductance  
Lead Free Finish/RoHS Compliant("P" Suffix  
designates RoHS Compliant. See ordering information)  
Mechanical Data  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
SOD123  
x
Terminals: Solderable per MIL-STD-202, Method 208  
Polarity: Indicated by Cathode Band  
Weight: 0.01 grams (approx.)  
A
B
Marking Code: T4,A2  
C
E
Absolute maximum Ratings  
Symbol  
VRM  
VR  
VR(RMS)  
IFM  
Parameter  
Peak Repetitive Reverse Voltage  
DC Reverse Blocking Voltage  
RMS Reverse Voltage  
Rating  
100  
100  
71  
300  
150  
2
Unit  
V
V
V
mA  
mA  
H
Peak Forward Current  
D
IO  
Average Rectified Output Current  
Forward Surge Current @1us  
@1s  
Power Dissipation  
Thermal Resistance Junction to Ambient  
IFSM  
PD  
A
1
400  
312.5  
mW  
OC/W  
OC  
J
G
R
E
ja  
TJ  
Operating Junction Temperature  
Storage Temperature  
-65 to +150  
-65 to +150  
TSTG  
OC  
DIMENSIONS  
DIM  
INCHES  
MIN  
MM  
NOTE  
MAX  
.152  
.112  
.071  
.053  
.031  
-----  
.01  
MIN  
3.55  
2.55  
1.40  
-----  
0.30  
0.15  
-----  
-----  
MAX  
3.85  
2.85  
1.80  
1.35  
.78  
-----  
.25  
.15  
A
B
C
D
E
G
H
J
.140  
.100  
.055  
-----  
.012  
.006  
-----  
-----  
O
Electrical Characteristics @ 25 C Unless Otherwise Specified  
Symbol  
Parameter  
Min  
Max  
Units  
OFF CHARACTERISTICS  
Forward Voltage Drop  
.006  
(IF=1mAdc)  
---  
---  
---  
---  
0.715  
0.855  
1.00  
VF  
IR  
(IF=10mAdc)  
(IF=50mAdc)  
(IF=150mAdc)  
Vdc  
SUGGESTED SOLDER  
PAD LAYOUT  
1.25  
0.093  
Reverse Current  
---  
---  
---  
1.0  
0.025  
50  
(VR=75Vdc,T=2ꢀ?)  
(VR=20Vdc,T=2ꢀ?)  
(VR=75Vdc,T=150?)  
uAdc  
0.048”  
CT  
Total Capacitance  
(VR=0Vdc, f=1.0MHz)  
---  
---  
2.0  
4.0  
pF  
ns  
Trr  
Reverse Recovery Time  
(Irr=0.1*IR, IF=IR10mAdc, RL=100=)  
0.036”  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 3  

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