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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 1914 | CTS |
获取价格 |
Miniature OCXO |
|
| 19140-0035 | MOLEXKITS |
获取价格 |
Assorted Non-Insulated .250 Quick Disconnect Ring, Spade, Butt Splice and Terminal |
|
| 19140-0036 | MOLEXKITS |
获取价格 |
Assorted Non-Insulated Quick Disconnect, Ring, Spade and Butt Splice Solderless Terminals |
|
| 19140-0037 | MOLEXKITS |
获取价格 |
Assorted Non-Insulated Quick Disconnect, Ring, Spade and Butt Splice Solderless Terminals |
|
| 19140004 | CMLMICRO |
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Dual Color LED, Super Red/green |
|
| 19140-0090 | MOLEXKITS |
获取价格 |
Assorted Non-Insulated .250 Quick Disconnect Ring, Spade, Butt Splice and Terminal |
|
| 191400091 | MOLEX |
获取价格 |
Fork Terminal, |
|
| 19140-0091 | MOLEXKITS |
获取价格 |
Assorted Non-Insulated Quick Disconnect, Ring, Spade and Butt Splice Solderless Terminals |
|
| 19140-0093 | MOLEXKITS |
获取价格 |
Assorted Non-Insulated .250 Quick Disconnect Ring, Spade, Butt Splice and Terminal |
|
| 19140-01M-1 | COOPER |
获取价格 |
Analog Circuit |
|
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
联发科推出全球首款3纳米汽车芯片CT-X1，挑战高通SA8295
国家大基金减持三家半导体企业，市场反应各异
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