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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 1888655-2 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-3 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-4 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-5 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888658 | PHOENIX |
获取价格 |
Barrier Strip Terminal Block, |
|
| 1888674-1 | MACOM |
获取价格 |
Quick Reference Guide |
|
| 1888674-1 | TE |
获取价格 |
Quad Small Form- factor Pluggable (QSFP) Products |
|
| 1888687 | PHOENIX |
获取价格 |
Barrier Strip Terminal Block, 16A, 2.5mm2, 1 Row(s), 1 Deck(s), ROHS COMPLIANT |
|
| 1888690 | PHOENIX |
获取价格 |
Modular Terminal Block, 16A, 2.5mm2 |
|
| 1888700 | PHOENIX |
获取价格 |
Barrier Strip Terminal Block, 16A, 2.5mm2, 1 Row(s), 1 Deck(s), ROHS COMPLIANT |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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