Datasheet > 171565-3002

171565-3002

更新时间： 2024-11-09 19:15:59

品牌	Logo	应用领域
莫仕 - MOLEX		连接器
页数	文件大小	规格书
4页	193K
描述
Telecom and Datacom Connector

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

171565-3002 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8536.69.40.30
风险等级：	5.7	连接器类型：	TELECOM AND DATACOM CONNECTOR
联系完成配合：	NOT SPECIFIED	触点材料：	NOT SPECIFIED
Base Number Matches：	1

171565-3002 数据手册

zQuad Small Form-

factor Pluggable

Plus (zQSFP+)

Interconnect

Supporting next-generation 100 Gbps Ethernet and 100

Gbps InﬁniBand* Enhanced Data Rate (EDR) applications,

Molex’s zQSFP+ Interconnect Solution transmits up

to 25 Gbps per-serial-lane data rates with excellent

signal integrity (SI), electro magnetic interference (EMI)

protection and thermal cooling

System

170432 SMT Connectors

171565 Stacked Integrated

2-by-1, 2-by-2 and

2-by-3 Connectors

and Cages

Molex’s zQuad Small Form-factor Pluggable Plus (zQSFP+) interconnect

solution is designed for high-density interconnect applications and conforms

to SFF-8665 QSFP28. Components of the system include SMT connectors

(series 170432); and stacked integrated 2-by-1, 2-by-2 and 2-by-3 connectors

and cages (series 171565). Products scheduled for upcoming release include:

copper passive cable assemblies (Series 111114); EMI cages (Series 111115)

and active optical cables (Series 106412).

Molex’s zQSFP+ SMT connector supports new 100 Gbps Ethernet and

100 Gbps InﬁniBand* (IB) Enhanced Data Rate (EDR) applications. EDR

applications consist of four lanes of high-speed differential signals with

individual data rates at 25 Gbps. The preferential coupling design uses a

narrow-edge coupled, blanked- and formed-contact geometry and insert

molding to optimize electrical performance. The zQSFP+ connector shares

the same mating interface as the QSFP+ form factor, making it backward

compatible with current connectors, cages and cable assemblies. Overall

connector length is 2.20mm deeper than the current QSFP+ connector.

zQSFP+ SMT Connector (Series 170432)

Soon-to-be-released zQSFP+ EMI cages will be designed with an advanced

heat-sink system to provide a high level of heat dissipation for next-

generation system-power levels. The spring-ﬁnger design will provide optimal

EMI grounding and allow for more space to route high-speed traces.

Future low-power, integrated active optical cable (AOC) solutions will provide

less expensive, reliable transport for aggregated data rates up to 100 Gbps.

The singlemode ﬁber technology will provide long reaches of up to 4km,

enabling deployment in data centers and campus environments.

zQSFP+ Stacked, Integrated, 2-by-1

Connector and Cage (Series 171565)

*InﬁniBand is a registered trademark of the InﬁniBand Trade Association

12 3 4

中文翻译

下载PDF

与171565-3002相关器件

型号	品牌	获取价格	描述	数据表
1715653003	MOLEX	获取价格	Telecom and Datacom Connector,
1715657	PHOENIX	获取价格	Barrier Strip Terminal Block,
1715659	PHOENIX	获取价格	Barrier Strip Terminal Block,
1715660	PHOENIX	获取价格	Barrier Strip Terminal Block,
1715662	PHOENIX	获取价格	Barrier Strip Terminal Block,
1715682	PHOENIX	获取价格	MKDS 1,5/ 3 BU
17156C	MURATA	获取价格	Radial Lead Inductors
171-56G	MACOM	获取价格	FLAT CABLE 28 AWG STRANDED PVC INSULATION
1715-7	WINCHESTER	获取价格	PCB Terminal
1715714	PHOENIX	获取价格	Barrier Strip Terminal Block,

与171565-3002相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

22
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

21
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

48
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

39

产品中心

服务支持

精选活动

关于我们

帮助中心

171565-3002

171565-3002 技术参数

171565-3002 数据手册

与171565-3002相关器件

与171565-3002相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

171565-3002

171565-3002 技术参数

171565-3002 数据手册

与171565-3002相关器件

与171565-3002相关文章

您还可以找

您在本页遇到什么问题？