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170

更新时间： 2024-11-04 05:56:51

品牌	Logo	应用领域
TTELEC		电源电路
页数	文件大小	规格书
2页	40K
描述
Custom Power Modules

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170 数据手册

MODEL 170

Custom Power Modules

CUSTOM POWER MODULES

DESCRIPTION

BI’s Custom Power Modules are designed to assemble all

of your circuit’s power components into one, easy to

manage, package. Power modules offer a low cost

method to improve the circuit density. These modules will

also reduce the assembly labor by eliminating insulating

pads and reducing the individual bolting of discreet power

semiconductors. BI offers power module designs that

allow the module to be soldered to the circuit board at the

same time as the other components, eliminating hand

soldering operations. Power modules allow the use of a

simpler and less expensive heat sink.

All the power components normally bolted to the heat sink

should be included in the custom module.

TYPICAL APPLICATIONS

FEATURES AND BENEFITS

• Power supply subassemblies

• Motor driver

• Low cost custom modules

• Reduced circuit size

• Power ampliﬁer

• H-Bridge

• Bridge rectiﬁer

• Allows simpliﬁed heat sink

• Soldering technique minimizes voids

• Flexible package dimensions

• Ganged power FETs

PACKAGING

Package Size

Package, Typical

Custom packaging from 0.3” to 4.0” on a side.

Heat sink attachment and heat transfer.

Package Conﬁgurations

Ceramic substrate, typically copper clad to promote heat transfer.

Base with mounted components is assembled into a custom frame and encapsulated.

Speciﬁcations subject to change without notice.

Model 170

7-13

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