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10WT10FN

更新时间: 2024-02-02 04:39:43
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 152K
描述
High Performance Generation 5.0 Schottky Rectifier, 10 A

10WT10FN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-252AA
包装说明:ROHS COMPLIANT, DPAK-3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.82
应用:EFFICIENCY外壳连接:CATHODE
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):0.66 V
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
最大非重复峰值正向电流:610 A元件数量:1
相数:1端子数量:2
最高工作温度:175 °C最低工作温度:-55 °C
最大输出电流:10 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大重复峰值反向电压:100 V子类别:Rectifier Diodes
表面贴装:YES技术:SCHOTTKY
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

10WT10FN 数据手册

 浏览型号10WT10FN的Datasheet PDF文件第2页浏览型号10WT10FN的Datasheet PDF文件第3页浏览型号10WT10FN的Datasheet PDF文件第4页浏览型号10WT10FN的Datasheet PDF文件第5页浏览型号10WT10FN的Datasheet PDF文件第6页浏览型号10WT10FN的Datasheet PDF文件第8页 
Outline Dimensions  
Vishay Semiconductors  
I-PAK - S, D-PAK  
DIMENSIONS FOR D-PAK in millimeters and inches  
(5)  
(3)  
A
Pad layout  
C
A
E
0.265  
MIN.  
M C A B  
b3  
0.010  
c2  
(6.74)  
A
H
E1  
L3 (3)  
Ø 1  
4
4
Ø 2  
0.245  
(6.23)  
B
MIN.  
MIN.  
Seating  
plane  
D1  
D (5)  
0.488 (12.40)  
0.409 (10.40)  
L4  
1
3
3
2
1
2
0.089  
(2.28)  
(2) L5  
Detail “C”  
A
0.06  
(1.524)  
b
0.010  
MIN.  
c
b2  
M C A B  
e
2 x  
0.093 (2.38)  
0.085 (2.18)  
Detail “C”  
(L1)  
Rotated 90 °CW  
Scale: 20:1  
H
Lead tip  
(7)  
C
Gauge  
plane  
C
Seating  
plane  
C
L2  
A1  
Ø
L
MILLIMETERS  
INCHES  
MILLIMETERS  
INCHES  
MIN. MAX.  
0.090 BSC  
SYMBOL  
NOTES  
SYMBOL  
NOTES  
MIN.  
2.18  
-
MAX.  
2.39  
0.13  
0.89  
1.14  
5.46  
0.61  
0.89  
6.22  
-
MIN.  
0.086  
-
MAX.  
0.094  
0.005  
0.035  
0.045  
0.215  
0.024  
0.035  
0.245  
-
MIN.  
MAX.  
A
A1  
b
e
2.29 BSC  
H
9.40  
1.40  
10.41  
1.78  
0.370  
0.055  
0.410  
0.070  
0.64  
0.76  
4.95  
0.46  
0.46  
5.97  
5.21  
6.35  
4.32  
0.025  
0.030  
0.195  
0.018  
0.018  
0.235  
0.205  
0.250  
0.170  
L
b2  
b3  
c
L1  
L2  
L3  
L4  
L5  
Ø
2.74 BSC  
0.51 BSC  
0.108 REF.  
0.020 BSC  
3
0.89  
1.27  
1.02  
1.52  
10°  
0.035  
0.050  
0.040  
0.060  
10°  
3
2
c2  
D
-
-
0.045  
0°  
5
3
5
3
1.14  
0°  
D1  
E
6.73  
-
0.265  
-
Ø1  
Ø2  
0°  
15°  
0°  
15°  
E1  
25°  
35°  
25°  
35°  
Notes  
(1)  
(2)  
(3)  
(4)  
(5)  
Dimensioning and tolerancing as per ASME Y14.5M-1994  
Lead dimension uncontrolled in L5  
Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad  
Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip  
Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at  
the outermost extremes of the plastic body  
(6)  
(7)  
(8)  
Dimension b1 and c1 applied to base metal only  
Datum A and B to be determined at datum plane H  
Outline conforms to JEDEC outline TO-252AA  
www.vishay.com  
2
For technical questions within your region, please contact one of the following:  
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
Document Number: 95024  
Revision: 05-Jan-11  

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