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10114868-Y0J-10DLF PDF预览

10114868-Y0J-10DLF

更新时间: 2024-11-08 11:45:51
品牌 Logo 应用领域
FCI-CONNECTOR 连接器PC
页数 文件大小 规格书
4页 1431K
描述
XCede? High-Performance Backplane Connector System

10114868-Y0J-10DLF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:LEAD FREE
Reach Compliance Code:compliantFactory Lead Time:11 weeks 1 day
风险等级:5.62Is Samacsys:N
其他特性:POLARIZED主体宽度:0.551 inch
主体深度:0.528 inch主体长度:0.543 inch
连接器类型:BOARD CONNECTOR联系完成配合:GOLD (30)/NICKEL PALLADIUM GOLD
联系完成终止:Tin (Sn) - with Nickel (Ni) barrier触点性别:MALE
触点材料:COPPER ALLOY触点模式:STAGGERED
触点电阻:55 m Ω触点样式:BLADE PIN-SKT
DIN 符合性:NO滤波功能:NO
IEC 符合性:NO最大插入力:.6394 N
绝缘电阻:1000000000 Ω绝缘体颜色:GRAY
绝缘体材料:THERMOPLASTICJESD-609代码:e3
MIL 符合性:NO混合触点:NO
安装选项1:GUIDE PIN安装选项2:LOCKING
安装方式:STRAIGHT安装类型:BOARD
连接器数:ONE选件:GENERAL PURPOSE
PCB接触模式:STAGGERED极化密钥:POLARIZED KEY
参考标准:UL可靠性:COMMERCIAL
子类别:Headers and Edge Type Connectors端接类型:PRESS FIT
触点总数:16UL 易燃性代码:94V-0
撤离力-最小值:.14734 NBase Number Matches:1

10114868-Y0J-10DLF 数据手册

 浏览型号10114868-Y0J-10DLF的Datasheet PDF文件第2页浏览型号10114868-Y0J-10DLF的Datasheet PDF文件第3页浏览型号10114868-Y0J-10DLF的Datasheet PDF文件第4页 
BAcKpAneL connectors  
XCede® HigH-PꢀrformanCꢀ  
BaCkPlanꢀ ConnꢀCtor SyStꢀm  
Description  
Fci’ꢀ Xcꢁdꢁ® ꢂꢃꢄꢄꢁꢂꢅꢃꢆ ꢇlaꢅfꢃꢆm ꢈꢀ dꢁꢀꢈgꢄꢁd fꢃꢆ 25 Gb/ꢀ  
ꢇꢁꢆfꢃꢆmaꢄꢂꢁ ꢅꢃ ꢇꢆꢃvꢈdꢁ ꢅhꢁ hꢁadꢆꢃꢃm ꢅꢃ ꢀuꢇꢇꢃꢆꢅ fuꢅuꢆꢁ  
hꢈgh-ꢀꢇꢁꢁd, ꢀꢁꢆꢈal daꢅa ꢆaꢅꢁ ꢆꢁquꢈꢆꢁmꢁꢄꢅꢀ dꢁmaꢄdꢁd by  
ꢄꢁxꢅ-gꢁꢄꢁꢆaꢅꢈꢃꢄ ꢁquꢈꢇmꢁꢄꢅ ꢈꢄ daꢅa ꢂꢁꢄꢅꢁꢆꢀ aꢄd ꢀꢁꢆvꢈꢂꢁ  
ꢇꢆꢃvꢈdꢁꢆ ꢄꢁꢅwꢃꢆkꢀ. thꢁ uꢀꢁ ꢃf ꢁꢄgꢈꢄꢁꢁꢆꢈꢄg ꢇꢃlymꢁꢆꢀ ꢈꢄ a  
ꢆꢁꢀꢃꢄaꢄꢂꢁ-damꢇꢈꢄg ꢀhꢈꢁld ꢁꢄablꢁꢀ vꢁꢆy lꢃw ꢂꢆꢃꢀꢀꢅalk  
aꢂꢆꢃꢀꢀ a wꢈdꢁ fꢆꢁquꢁꢄꢂy ꢆaꢄgꢁ.  
Xcꢁdꢁ ꢂꢃꢄꢄꢁꢂꢅꢃꢆꢀ alꢀꢃ addꢆꢁꢀꢀ ꢆꢁquꢈꢆꢁmꢁꢄꢅꢀ fꢃꢆ hꢈghꢁꢆ  
lꢈꢄꢁaꢆ ꢀꢈgꢄal dꢁꢄꢀꢈꢅy aꢅ ꢅhꢁ ꢈꢄꢅꢁꢆfaꢂꢁ ꢃf baꢂkꢇlaꢄꢁ aꢄd  
daughꢅꢁꢆ ꢂaꢆd. sꢈgꢄal ꢂꢃꢄꢄꢁꢂꢅꢃꢆꢀ ꢂaꢄ bꢁ ꢂꢃꢄfꢈguꢆꢁd wꢈꢅh  
2, 4 ꢃꢆ 6 dꢈffꢁꢆꢁꢄꢅꢈal ꢇaꢈꢆꢀ ꢇꢁꢆ ꢂꢃlumꢄ, ꢇꢆꢃvꢈdꢈꢄg uꢇ ꢅꢃ 82.4  
dꢈffꢁꢆꢁꢄꢅꢈal ꢇaꢈꢆꢀ/ꢈꢄꢂh, ꢀuꢈꢅꢈꢄg aꢆꢂhꢈꢅꢁꢂꢅuꢆꢁꢀ wꢈꢅh mulꢅꢈꢇlꢁ  
fꢆꢃꢄꢅ ꢃꢆ ꢆꢁaꢆ fabꢆꢈꢂ ꢀlꢃꢅꢀ aꢄd bladꢁ ꢀyꢀꢅꢁmꢀ wꢈꢅh ꢂꢃꢃlꢈꢄg  
ꢀꢅꢆaꢈghꢅ ꢅhꢆꢃugh ꢅhꢁ baꢂkꢇlaꢄꢁ. cꢃmꢇlꢁmꢁꢄꢅaꢆy guꢈdaꢄꢂꢁ  
aꢄd ꢇꢃwꢁꢆ mꢃdulꢁꢀ aꢆꢁ alꢀꢃ ꢈꢄꢂludꢁd ꢈꢄ ꢅhꢁ ꢇꢆꢃduꢂꢅ  
ꢆaꢄgꢁ. A wafꢁꢆ ꢃꢆgaꢄꢈzꢁꢆ ꢂaꢄ bꢁ uꢀꢁd ꢅꢃ ꢂꢃmbꢈꢄꢁ gꢆꢃuꢇꢀ  
ꢃf ꢆꢈghꢅ-aꢄglꢁ ꢀꢈgꢄal, guꢈdaꢄꢂꢁ aꢄd ꢇꢃwꢁꢆ mꢃdulꢁꢀ aꢀ aꢄ  
ꢈꢄꢅꢁgꢆaꢅꢁd daughꢅꢁꢆ-ꢂaꢆd ꢂꢃꢄꢄꢁꢂꢅꢃꢆ.  
thꢁ Xcꢁdꢁ baꢂkꢇlaꢄꢁ hꢁadꢁꢆ ꢀyꢀꢅꢁm ꢇꢆꢃvꢈdꢁꢀ ꢅhꢁ  
ꢆuggꢁdꢄꢁꢀꢀ aꢄd lꢃꢄg-ꢅꢁꢆm ꢆꢁlꢈabꢈlꢈꢅy ꢆꢁquꢈꢆꢁd by ꢅꢃday’ꢀ  
ꢀyꢀꢅꢁmꢀ. thꢁ wꢈdꢁ gꢆꢃuꢄd ꢂꢃꢄꢅaꢂꢅꢀ fꢁaꢅuꢆꢁ a ꢀꢅꢈffꢄꢁꢀꢀ-  
ꢁꢄhaꢄꢂꢈꢄg ꢆꢈb aꢄd aꢆꢁ advaꢄꢂꢁd wꢁll ahꢁad ꢃf ꢅhꢁ ꢀꢈgꢄalꢀ  
fꢃꢆ ꢁxꢂꢁꢇꢅꢈꢃꢄal ꢆꢃbuꢀꢅꢄꢁꢀꢀ aꢄd ꢀꢈgꢄal ꢇꢈꢄ ꢇꢆꢃꢅꢁꢂꢅꢈꢃꢄ.  
FeAtꢉres & BeneFits  
tArGet MArKets / AppLicAtions  
High-speed backplane system designed for 25 Gb/s  
Use of engineering materials in the shield aids in  
reduction of crosstalk resonances  
1.85 mm column pitch offers high linear signal density  
• Configurations with 6 differential pairs/column fit 36 mm  
card slot pitch and provide 82.4 pairs/inch  
• 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch  
• 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch  
Two ground vias between differential pairs allow elongated  
antipads to further improve impedance  
Optional short compliant pin permits deeper backdrilling and  
dual diameter vias to enhance return loss performance  
Wide ground contacts feature a stiffening rib and are  
advanced well ahead of signals for exceptional robustness  
and signal pin protection  
Communications  
Routers  
Switches  
Networking  
Access  
Transport  
Wireless  
Data  
Servers  
Storage Systems  
Industrial  
Medical  
Test & Measurement  
Intermateable, electrically and mechanically interchangeable  
licensed second source to Amphenol TCS  
Xcꢁdꢁ® ꢈꢀ a ꢆꢁgꢈꢀꢅꢁꢆꢁd ꢅꢆadꢁmaꢆk ꢃf Amꢇhꢁꢄꢃl cꢃꢆꢇꢃꢆaꢅꢈꢃꢄ  

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