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09009-02KBCZ PDF预览

09009-02KBCZ

更新时间: 2024-11-12 11:17:15
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
3页 242K
描述
SRC9000 Low ESR Tantalum Stacked Chip

09009-02KBCZ 数据手册

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TCP Series - DSCC 09009  
TCP Series Low ESR Tantalum Modules  
TCP Series tantalum modules  
a wide range of SMT board assembly  
processes including reflow solder or  
conductive epoxy.  
represent high packing density for  
applications utilizing multiple com-  
ponents in a parallel configuration,  
and are available with testing to  
DSCC 09009.  
There are two termination finishes  
available: hot solder dipped (“C”) and  
gold plated (“B”).  
These modules feature stacked  
assemblies of CWR29 capacitors  
which provide ultra low ESR and uti-  
lize established reliability capacitors  
(Weibull Grade voltage conditioning)  
in accordance with MIL-PRF-55365.  
They can also be supplied with  
SRC9000 Space Level components.  
The molding compound has been  
selected to meet the requirements of  
UL94V-0 and outgassing require-  
ments of ASTM E-595.  
For moisture sensitivity levels please  
refer to the High Reliability Tantalum  
MSL section located in the back of  
the High Reliability Tantalum Catalog.  
W
L
The stacked construction of fully  
molded capacitors is compatible with  
Note: Additional form factors and ratings are available.  
Contact plant for details.  
H
CAPACITANCE AND RATED VOLTAGE  
CASE SIZE (ESR IN m)  
Capacitance  
Rated voltage DC (VR) to 85ºC  
μF  
9.4  
18.8  
20  
28.2  
40  
60  
Code  
945  
196  
206  
286  
406  
606  
666  
946  
137  
197  
207  
207  
287  
407  
447  
607  
667  
887  
138  
208  
6V  
10V  
15V  
20V  
25V  
35V  
50V  
2H (200)  
4H (100)  
2H (200)  
6H (67)  
4H (100)  
6H (67)  
66  
94  
2H (85)  
4H (43)  
6H (28)  
2H (75)  
4H (38)  
132  
188  
198  
200  
282  
400  
440  
600  
660  
880  
1,320  
1,980  
2H (63)  
4H (31)  
6H (21)  
6H (25)  
2H (50)  
2H (50)  
4H (25)  
6H (17)  
4H (25)  
6H (17)  
FEBRUARY 2015 27  

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