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0877050021

更新时间： 2024-10-30 06:23:39
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器双倍数据速率
页数 文件大小 规格书
8页 460K
描述
1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 2.67mm (.105") Tail Length, Beige Latches

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0877050021 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：ROHS AND REACH COMPLIANT
Reach Compliance Code：compliant风险等级：8.6
Is Samacsys：N其他特性：LATCHED, POLARIZED
主体/外壳类型：SOCKET连接器类型：CARD EDGE CONNECTOR
联系完成配合：GOLD (15)联系完成终止：Tin (Sn)
触点性别：FEMALE触点材料：PHOSPHOR BRONZE
DIN 符合性：NO滤波功能：NO
IEC 符合性：NOJESD-609代码：e3
MIL 符合性：NO混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
装载的行数：2选件：GENERAL PURPOSE
端子节距：1 mm端接类型：SOLDER
触点总数：240UL 易燃性代码：94V-0
Base Number Matches：1

0877050021 数据手册

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This document was generated on 05/27/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0877050021  
Active  
Description:  
1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 2.67mm (.105") Tail  
Length, Beige Latches, 0.38µm (15µ") Gold (Au) Plating, with Beveled Metal Pins, 240  
Circuits, Lead-Free  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-87705-002 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
1409726  
E29179  
EU RoHS  
ELV and RoHS  
Compliant  
General  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
Not Reviewed  
Need more information on product  
environmental compliance?  
Product Family  
Series  
Comments  
Component Type  
JEDEC Outline  
Product Name  
Memory Module Sockets  
87705  
<LI>Latches in Beige Color  
Socket  
MO-237  
DDR2 DIMM  
Physical  
Circuits (Loaded)  
Color - Resin  
Durability (mating cycles max)  
Entry Angle  
Flammability  
Keying to Mating Part  
Material - Metal  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
240  
Black, Natural  
25  
Vertical (Top Entry)  
94V-0  
Yes  
Please visit the Contact Us section for any  
non-product compliance questions.  
Brass, Phosphor Bronze  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Retention  
Gold  
Tin  
Search Parts in this Series  
87705Series  
High Temperature Thermoplastic  
0.105 In  
2.67 mm  
Yes  
Mates With  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.062 In  
1.60 mm  
Tray  
JEDEC standard 1.27mm modules  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Temperature Range - Operating  
Termination Interface: Style  
0.039 In  
1.00 mm  
15.2  
0.38  
101.6  
2.54  
-10°C to +85°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
0.5A  
30V  
1.8V, Center  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
5
SMC & Wave Capable (TH only)  
1
Max. Cycles at Max. Process Temperature  
12345678

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