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08051J1R5BBTTR\500 PDF预览

08051J1R5BBTTR\500

更新时间: 2024-11-17 11:19:11
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
19页 217K
描述
Thin Film Capacitor

08051J1R5BBTTR\500 数据手册

 浏览型号08051J1R5BBTTR\500的Datasheet PDF文件第2页浏览型号08051J1R5BBTTR\500的Datasheet PDF文件第3页浏览型号08051J1R5BBTTR\500的Datasheet PDF文件第4页浏览型号08051J1R5BBTTR\500的Datasheet PDF文件第5页浏览型号08051J1R5BBTTR\500的Datasheet PDF文件第6页浏览型号08051J1R5BBTTR\500的Datasheet PDF文件第7页 
®
®
Accu-F / Accu-P  
Thin-Film Technology  
This accuracy sets apart these Thin-Film capacitors from  
ceramic capacitors so that the term Accu has been  
employed as the designation for this series of devices, an  
abbreviation for “accurate.”  
THE IDEAL CAPACITOR  
The non-ideal characteristics of a real capacitor can be  
ignored at low frequencies. Physical size imparts inductance  
to the capacitor and dielectric and metal electrodes result in  
resistive losses, but these often are of negligible effect on the  
circuit. At the very high frequencies of radio communication  
(>100MHz) and satellite systems (>1GHz), these effects  
become important. Recognizing that a real capacitor will  
exhibit inductive and resistive impedances in addition to  
capacitance, the ideal capacitor for these high frequencies is  
an ultra low loss component which can be fully characterized  
in all parameters with total repeatability from unit to unit.  
THIN-FILM TECHNOLOGY  
Thin-film technology is commonly used in producing semi-  
conductor devices. In the last two decades, this technology  
has developed tremendously, both in performance and in  
process control. Todays techniques enable line definitions of  
below 1μm, and the controlling of thickness of layers at 100Å  
(10-2μm). Applying this technology to the manufacture of  
capacitors has enabled the development of components  
where both electrical and physical properties can be tightly  
controlled.  
1
Until recently, most high frequency/microwave capacitors  
were based on fired-ceramic (porcelain) technology. Layers  
of ceramic dielectric material and metal alloy electrode paste  
are interleaved and then sintered in a high temperature oven.  
This technology exhibits component variability in dielectric  
quality (losses, dielectric constant and insulation resistance),  
variability in electrode conductivity and variability in physical  
size (affecting inductance). An alternate thin-film technology  
has been developed which virtually eliminates these vari-  
ances. It is this technology which has been fully incorporated  
into Accu-F® and Accu-P® to provide high frequency capaci-  
tors exhibiting truly ideal characteristics.  
The thin-film production facilities at AVX consist of:  
• Class 1000 clean rooms, with working areas under  
laminar-flow hoods of class 100, (below 100 particles  
per cubic foot larger than 0.5μm).  
• High vacuum metal deposition systems for high-purity  
electrode construction.  
• Photolithography equipment for line definition down to  
2.0μm accuracy.  
The main features of Accu-F® and Accu-P® may be summa-  
rized as follows:  
• Plasma-enhanced CVD for various dielectric deposi-  
tions (CVD=Chemical Vapor Deposition).  
• High purity of electrodes for very low and repeatable  
ESR.  
• High accuracy, microprocessor-controlled dicing saws  
for chip separation.  
• Highly pure, low-K dielectric for high breakdown field,  
high insulation resistance and low losses to frequencies  
above 40GHz.  
• High speed, high accuracy sorting to ensure strict  
tolerance adherence.  
• Very tight dimensional control for uniform inductance,  
unit to unit.  
• Very tight capacitance tolerances for high frequency  
signal applications.  
TERMINATION  
ALUMINA  
SEAL  
ELECTRODE  
ELECTRODE  
DIELECTRIC  
ALUMINA  
ACCU-P® CAPACITOR  
6

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