DDR4 DIMM
Sockets,
Available in Press-fit, SMT and Through-hole mounting,
DDR4 DIMM sockets offer significant assembly-
processing compatibility and cost savings in high-speed
server memory applications
Halogen-free
78726 Vertical, Through hole
78730 Vertical, SMT
78731 Vertical, Press-fit
Meeting JEDEC specifications, Molex’s Vertical Press-fit, SMT and Through
hole DDR4 DIMM sockets support *UDIMMs, RDIMMs and LRDIMM memory
applications for data, computing, telecommunication and networking
servers with higher data speed and lower operating voltage than DDR3.
The new Press-fit DDR4 DIMM socket offers benefits of lower cost of
operation (clean, solderless process); elimination of added heat-cycle that
can cause stress to the PCB or degrade electronic components; ease-of-
application and connection-failure traceability, rework and termination
quality inspection; repair capability and more.
Other termination styles suit specific applications that give greater PCB real
estate cost savings. These include Series 78726 Through hole and 78730
SMT sockets with a highly compact socket footprint.
Molex’s DDR4 sockets feature high dimensional stability and excellent
compatibility in halogen-free and lead-free technologies. The use of less
moisture-sensitive, high-temperature housing material minimizes blistering
on the connector during high, IR-reflow processing temperatures for non
press-fit sockets. Reduced yield losses with the use of Molex DDR4 sockets
add to greater customer cost savings.
For more information, visit our website at: www.molex.com/link/ddr4.html.
Halogen-free DDR4 DIMM Sockets in
Press-fit (top), SMT (center) and Through
hole (bottom) configurations
Features and Benefits
Reduced connector footprint of 6.50mm (max.) (W)
by 162mm (L)
Provides increased PCB space and cost savings
Robust and more ergonomic latch design
Profiled contact terminals
Improves rip-out force and vibration resistance; makes
socket easy to use
Eliminate stress caused to housing during terminal
insertion and prevents housing warpage; anti-stubbing
Moisture-resistant, high-temperature housing material
Gives added dimensional stability to connector with
reduced yield loss and increased cost-savings. Able to
withstand infrared (IR), lead-free and wave soldering
temperatures
High connector durability
Supports up to 25 mating cycles
Step-and-ramp feature (on connector housing and
memory module)
Reduces insertion force of module without engaging all
gold fingers at the same time during module insertion
* UDIMMs: Unbuffered DIMMs offer the fastest memory speeds, lowest latencies, and (relatively) low power consumption but are
limited in capacity though.
RDIMM: Registered DIMMs, with their registers, are able to buffer the Address and Command signals between the DRAMs and the
memory controller thus increasing the amount of memory that a server can support, however, with increased power consumption
and memory latency.
LRDIMM: Load Reduced DIMMs use a buffer to reduce memory loading to a single load on all DDR signals, allowing for greater
density but at the highest power usage