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0787302152 PDF预览

0787302152

更新时间: 2024-11-09 02:56:31
品牌 Logo 应用领域
莫仕 - MOLEX 双倍数据速率
页数 文件大小 规格书
6页 3625K
描述
DDR4 DIMM Socket, Vertical Surface Mount, 0.38m Gold Plating, 288 Circuits

0787302152 数据手册

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DDR4 DIMM  
Sockets,  
Available in Press-fit, SMT and Through-hole mounting,  
DDR4 DIMM sockets offer significant assembly-  
processing compatibility and cost savings in high-speed  
server memory applications  
Halogen-free  
78726 Vertical, Through hole  
78730 Vertical, SMT  
78731 Vertical, Press-fit  
Meeting JEDEC specifications, Molex’s Vertical Press-fit, SMT and Through  
hole DDR4 DIMM sockets support *UDIMMs, RDIMMs and LRDIMM memory  
applications for data, computing, telecommunication and networking  
servers with higher data speed and lower operating voltage than DDR3.  
The new Press-fit DDR4 DIMM socket offers benefits of lower cost of  
operation (clean, solderless process); elimination of added heat-cycle that  
can cause stress to the PCB or degrade electronic components; ease-of-  
application and connection-failure traceability, rework and termination  
quality inspection; repair capability and more.  
Other termination styles suit specific applications that give greater PCB real  
estate cost savings. These include Series 78726 Through hole and 78730  
SMT sockets with a highly compact socket footprint.  
Molex’s DDR4 sockets feature high dimensional stability and excellent  
compatibility in halogen-free and lead-free technologies. The use of less  
moisture-sensitive, high-temperature housing material minimizes blistering  
on the connector during high, IR-reflow processing temperatures for non  
press-fit sockets. Reduced yield losses with the use of Molex DDR4 sockets  
add to greater customer cost savings.  
For more information, visit our website at: www.molex.com/link/ddr4.html.  
Halogen-free DDR4 DIMM Sockets in  
Press-fit (top), SMT (center) and Through  
hole (bottom) configurations  
Features and Benefits  
Reduced connector footprint of 6.50mm (max.) (W)  
by 162mm (L)  
Provides increased PCB space and cost savings  
Robust and more ergonomic latch design  
Profiled contact terminals  
Improves rip-out force and vibration resistance; makes  
socket easy to use  
Eliminate stress caused to housing during terminal  
insertion and prevents housing warpage; anti-stubbing  
Moisture-resistant, high-temperature housing material  
Gives added dimensional stability to connector with  
reduced yield loss and increased cost-savings. Able to  
withstand infrared (IR), lead-free and wave soldering  
temperatures  
High connector durability  
Supports up to 25 mating cycles  
Step-and-ramp feature (on connector housing and  
memory module)  
Reduces insertion force of module without engaging all  
gold fingers at the same time during module insertion  
* UDIMMs: Unbuffered DIMMs offer the fastest memory speeds, lowest latencies, and (relatively) low power consumption but are  
limited in capacity though.  
RDIMM: Registered DIMMs, with their registers, are able to buffer the Address and Command signals between the DRAMs and the  
memory controller thus increasing the amount of memory that a server can support, however, with increased power consumption  
and memory latency.  
LRDIMM: Load Reduced DIMMs use a buffer to reduce memory loading to a single load on all DDR signals, allowing for greater  
density but at the highest power usage  

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