Document 913-1
Chip Inductors – 0402HL (1005)
Core material Ceramic
•ꢀHigherꢀinductanceꢀvaluesꢀthanꢀotherꢀ0402ꢀceramicꢀchipꢀ
inductors
Environmental RoHS compliant, halogen free
•ꢀ12ꢀinductanceꢀvaluesꢀfromꢀ270ꢀnHꢀtoꢀ820ꢀnH
Terminations RoHS compliant matte tin over nickel over silver-plati-
num-glass frit. Other terminations available at additional cost.
Inductance2 SRF typ3 DCR max4 Irms5
Weight 0.7 – 1.3 mg
Part number1 ±±5 ꢀnꢁH
ꢀMꢁzH
ꢀOhmsH
ꢀmAH
Ambient temperature –40°C to +125°C with Irms current, +125°C
to +140°C with derated current
0402HL-271XJR_
0402HL-301XJR_
0402HL-331XJR_
0402HL-361XJR_
0402HL-391XJR_
0402HL-471XJR_
0402HL-511XJR_
0402HL-561XJR_
0402HL-601XJR_
0402HL-681XJR_
270
300
330
360
390
590
600
513
485
260
1.95
2.15
2.23
2.36
2.35
190
190
170
170
170
Storage temperature Component: –40°C to +140°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
470
510
560
600
680
220
450
420
440
380
2.67
3.50
3.70
3.78
5.15
160
150
140
130
120
Temperature Coefficient of Inductance ꢀTCLH +25 to +150 ppm/°C
Moisture Sensitivity Level ꢀMSLH 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time ꢀFITH / Mean Time Between Failures ꢀMTBFH
One per billion hours / one billion hours, calculated per Telcordia SR-332
0402HL-741XJR_
0402HL-821XJR_
740
820
165
385
5.45
5.85
110
90
Packaging 2000 per 7″ reel. Paper tape: 8 mm wide, 0.66 mm thick,
2 mm pocket spacing
1. When ordering, please specify termination and packaging codes:
0402ꢁL-821XJRW
PCB washing Only pure water or alcohol recommended
Termination: R = RoHS compliant matte tin over nickel over silver-
platinum-glass frit.
Special order: T = RoHS tin-silver-copper (95.5/4/0.5)
or S = non-RoHS tin-lead (63/37).
Packaging: W= 7″ machine-ready reel. EIA-481 punched paper
tape (2000 parts per full reel).
U = Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge),
use code letter W instead.
2. Inductance measured at 25 MHz using a Coilcraft SMD-F test fixture
and Coilcraft-provided correlation pieces with an Agilent/HP 4286
impedance analyzer.
3. SRF measured using Agilent/HP 8753D network analyzer and Coilcraft
SMD-D test fixture.
4. DCR measured on Cambridge Technology micro-ohmmeter and a
Coilcraft CCF858 test fixture.
5. Current that causes a 15°C temperature rise from 25°C ambient.
Because of their open construction, these parts will not saturate.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Amax Bmax Cmax
0.048 0.031 0.022 0.010 0.018 0.008 0.026 0.014 0.025 inches
1,22 0,79 0,56 0,25 0,46 0,20 0,66 0,36 0,64 mm
D
E
F
G
ꢁ
I
Document 913-1 Revised 10/04/11