0015800129

更新时间： 2024-11-30 06:18:31

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
7页	1222K
描述
2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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0015800129 数据手册

This document was generated on 05/24/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0015800069

Active

cgrid__sl_products

Overview:

Description:

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical,

Shrouded, High Temperature, 6 Circuits, 0.38µm (15µ") Gold, (Au) Selective Plating,

Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing

Documents:

3D Model

Drawing (PDF)

Product Specification PS-70567 (PDF)

RoHS Certificate of Compliance (PDF)

Series

image - Reference only

China RoHS

ELV and RoHS

Compliant

Packaging Specification (PDF)

EU RoHS

Agency Certification

CSA

LR19980

E29179

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

General

Product Family

Series

PCB Headers

70567

Not Reviewed

Need more information on product

environmental compliance?

Application

Overview

Product Name

Wire-to-Board

cgrid__sl_products

C-Grid®

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Physical

Breakaway

Circuits (Loaded)

Circuits (maximum)

Circuits Detail

Color - Resin

Please visit the Contact Us section for any

non-product compliance questions.

Black

Durability (mating cycles max)

First Mate / Last Break

Flammability

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

Material - Metal

94V-0

None

Yes

Search Parts in this Series

70567Series

Mates With

70013 Interim Clip

Brass, Phosphor Bronze

Material - Plating Mating

Material - Plating Termination

Material - Resin

Gold

Tin

High Temperature Thermoplastic

Number of Rows

Orientation

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Vertical

0.130 In

3.30 mm

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.093 In

2.36 mm

Tube

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

0.100 In

2.54 mm

0.100 In

2.54 mm

0.375

12 3 4 5 6 7

中文翻译

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与0015800129相关器件

型号	品牌	获取价格	描述	数据表
0015800129_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800141	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800141_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800143	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800143_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800145	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800147	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800147_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800149	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800149_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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