0015800185

更新时间： 2024-11-30 05:56:31

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
7页	1222K
描述
2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

0015800185 数据手册

This document was generated on 05/24/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0015800083

Active

cgrid__sl_products

Overview:

Description:

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical,

Shrouded, High Temperature, 8 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin

(Sn) PC Tail Plating

Documents:

3D Model

Drawing (PDF)

Product Specification PS-70567 (PDF)

RoHS Certificate of Compliance (PDF)

Series

image - Reference only

China RoHS

ELV and RoHS

Compliant

Packaging Specification (PDF)

EU RoHS

Agency Certification

CSA

LR19980

E29179

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

General

Product Family

Series

PCB Headers

70567

Not Reviewed

Need more information on product

environmental compliance?

Application

Overview

Product Name

Wire-to-Board

cgrid__sl_products

C-Grid®

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Physical

Breakaway

Circuits (Loaded)

Circuits Detail

Color - Resin

First Mate / Last Break

Flammability

Please visit the Contact Us section for any

non-product compliance questions.

Black

94V-0

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

Material - Metal

None

Yes

Search Parts in this Series

70567Series

Brass, Phosphor Bronze

Material - Plating Mating

Material - Plating Termination

Material - Resin

Gold

Tin

Mates With

70450 Crimp Housing

High Temperature Thermoplastic

Number of Rows

Orientation

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Vertical

0.130 In

3.30 mm

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.093 In

2.40 mm

Tube

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to Mating Part

0.100 In

2.54 mm

0.100 In

2.54 mm

0.375

1.875

Yes

12 3 4 5 6 7

中文翻译

下载PDF

与0015800185相关器件

型号	品牌	获取价格	描述	数据表
0015800185_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800187	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800187_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800189	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800189_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800201	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800201_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800203	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H
0015800203_17	MOLEX	获取价格	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
0015800205	MOLEX	获取价格	2.54mm (.100) Pitch C-Grid® Header, Through H

与0015800185相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

53
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

42
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

70
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

66

产品中心

服务支持

精选活动

关于我们

帮助中心

0015800185

0015800185 数据手册

与0015800185相关器件

与0015800185相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

0015800185

0015800185 数据手册

与0015800185相关器件

与0015800185相关文章

您还可以找

您在本页遇到什么问题？