ZXMS81045SPQ
Package Thermal Data
Symbol
Parameter
Min
Typ
Max
Unit
Thermal Resistance, Junction-to-Case (Note 9)
Thermal Resistance, Junction-to-Ambient mounted on PCB
(Note 9, 10)
-
-
5.2
42
-
-
K/W
K/W
RθJC
RθJA
Notes:
9.
Not subject to production test, guaranteed by design
10.
Device mounted on vertical PCB, 2” x 2” x 1.6 mm, FR4 with 2oz copper for all connections
Recommended Operating Conditions
Symbol
Parameter
Min
Max
Unit
Nominal operating supply voltage (Note 11)
Extended operating voltage (Note 12)
8
5
18
28
V
V
VS(NOM)
VS(OP)
Notes:
11.
12.
For normal function and protection features
Operation across an extended range is possible but is load dependant – device may have reduced protection against faulty (overload or short-circuit) loads
Operational Electrical Characteristics Unless otherwise specified: Tj = 25°C
Symbol
General
VS(OP)
Parameter
Conditions
Min
Typ
Max
Unit
Extended operating voltage (Note 13)
Undervoltage restart (Note 13)
5
13.5
4.2
28
5
V
V
VIN = 4.5V, VDS < 0.5V
3.8
VS(OP_MIN)
VIN = 4.5V, RL = 4Ω
VIN = 4.5V, VDEN = 0V
RL = 4Ω
Undervoltage shutdown (Note 13)
Undervoltage hysteresis
3
-
3.3
0.85
2
4.1
-
V
V
VS(UV)
-
VS(UV_HYS)
IGND
VIN = VDEN = 5.5V, VS = 18V
device in RDS(ON)
Operating current (Note 13)
-
6
mA
VIN and VDEN floating,
VOUT = 0V, VS = 18V
-
-
-
0.1
3.5
1
0.5
µA
µA
Stand-by current
IS(OFF)
VIN and VDEN floating,
VOUT = 0V, VS = 18V
TJ = 150°C
-
-
VIN floating, VOUT = 0 V
VS = 18V, VDEN = 5.5V
Stand-by current with diagnostic pin active
mA
IS(OFF_DEN)
Notes:
13.
Guaranteed across temperatute range with inset limits at production test
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www.diodes.com
July 2023
ZXMS81045SPQ
© 2023 Copyright Diodes Incorporated. All Rights Reserved.
Document number: DS44103 Rev. 4 - 2