Datasheet > ZRB186R60G226ME11#

ZRB186R60G226ME11#

更新时间： 2023-09-03 20:31:53

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ZRB186R60G226ME11# 数据手册

Substrate Bending test

Except for Substrate Bending test

・Test substrate

Material

Thickness

・Test substrate

Material

Thickness

JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

1.6mm

JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

1.6mm or 0.8mm

Copper Foil Thickness 0.035mm

Kind of Solder

Sn-3.0Ag-0.5Cu(Lead Free Solder)

Kind of Solder

Sn-3.0Ag-0.5Cu(Lead Free Solder)

・Land Dimension

Dimension(mm)

Type

ZRB18

1.0

3.0

1.2

ZRB18

1.0

3.0

1.2

・Pressurization Method

ZRB186R60G226ME11-01A

1 2 3 456 7 8...27

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