Chip Zener Diode
Formosa MS
ZGFM306V8B THRU ZGFM30200B
List
1
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
2
2
2
2
3
4~5
6
6
7
8
8
9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121741
Issued Date
2009/08/10
Revised Date
2011/07/01
Revision
D
Page.
9
Page 1