Chip Zener Diode
Formosa MS
ZGFM103V3B-M THRU ZGFM10330B-M
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List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121708
Issued Date
2008/02/10
Revised Date
2012/10/12
Revision
G
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