Datasheet > ZGFM1033-M

ZGFM1033-M

更新时间： 2024-11-17 00:36:39

品牌	Logo	应用领域
PACELEADER		/
页数	文件大小	规格书
3页	267K
描述
SURFACE MOUNT ZENER TYPE

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数据手册

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ZGFM1033-M 数据手册

ZGFM103V3-M THRU ZGFM10100-M

SSUURRFFAACCEE MMOOUUNNTT ZZEENNEERR TTYYPPEE

SOD-123

0.154(3.9)

0.138(3.5)

0.012(0.3) Typ.

0.071(1.8)

0.055(1.4)

0.067(1.7)

0.051(1.3)

0.028(0.7) Typ.

Dimensions in inches and (millimeters)

FEATURES

MECHANICAL DATA

• Batch process design, excellent power dissipation offers

• Epoxy : UL94-V0rated flame retardant

• Case : Moldedplastic, SOD-123

better reverse leakage current and thermal resistance.

• Silicon epitaxial planar chip structure.

• Wide zener reverse voltage range 3.3V to 100V.

• Small package size for high density applications.

• Ideally suited for automated assembly processes.

• Terminals:Plated terminals, solderableper MIL-STD-750,

Method 2026

• Polarity : Indicatedby cathode band

• Mounting Position :Any

• Lead-free parts meet environmental standards of

MIL-STD-19500 /228

• Weight : Approximated 0.027gram

MAXIMUM RATINGS (at TA=25 C unless otherwise noted)

PARAMETER

CONDITIONS

Symbol MIN. TYP. MAX. UNIT

Forward voltage

I_F= 200 mADC

V_F

P_D

1.20

Power Dissipation

1000

8.3ms single half sine-wave superimposed

on rate load (JEDEC methode)

I_FSM

Forward surge current

100

Storage temperature

Operating temperature

T_STG

T_J

-65

-55

+175

+150

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