Datasheet > XX1005-BD

XX1005-BD

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
MIMIX		倍频器
页数	文件大小	规格书
6页	218K
描述
8.0-12.0/16.0-24.0 GHz GaAs MMIC Active Doubler

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XX1005-BD 数据手册

8.0-12.0/16.0-24.0 GHz GaAs MMIC

Active Doubler

January 2007 - Rev 17-Jan-07

X1005-BD

Mechanical Drawing

0.503

0.683

0.884

1.085

(0.020)

(0.027) (0.035) (0.043)

0.890

(0.035)

XX1005-BD

0.356

(0.014)

0.0

1.620

0.0

(0.064)

(Note: Engineering designator is 20DBL0451)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 0.891 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vg1)

Bond Pad #3 (Vg2)

Bond Pad #4 (Vd1)

Bond Pad #5 (Vd2)

Bond Pad #6 (RF Out)

Bypass Capacitors - See App Note [2]

Vd1 Vd2

Bias Arrangement

Vg2

Vg1

Vg2

Vd1

Vd2

Vg1

XX1005-BD

RF In

RF Out

Page 3 of 6

Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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