Datasheet > XX1004-BD-EV1

XX1004-BD-EV1

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
MIMIX		倍频器
页数	文件大小	规格书
6页	227K
描述
10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler

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XX1004-BD-EV1 数据手册

10.0-13.0/20.0-26.0 GHz GaAs MMIC

Active Doubler

February 2007 - Rev 16-Feb-07

X1004-BD

0.483

0.881

Mechanical Drawing

(0.019)

(0.035)

0.970

(0.038)

0.605

(0.024)

XX1004-BD

0.362

(0.014)

0.0

1.620

0.394

(0.016)

0.795

(0.031)

(0.064)

(Note: Engineering designator is 12DBL0409)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.115 +/- 0.010 (0.0045 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 0.974 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (Vd2)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg2)

Bond Pad #6 (Vg1)

Bias Arrangement

Bypass Capacitors - See App Note [2]

Vd1

Vd2

RF In

RF Out

XX1004-BD

RF Out

Vg1

Vg2

Vg1

Vg2

Page 3 of 6

Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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