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Datasheet > XRN740-1005GAGP
XRN740-1005GAGP PDF预览

XRN740-1005GAGP

更新时间： 2024-11-21 04:23:31
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CALMIRCO /
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描述
Stable Extended Capability Chip Series

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XRN740-1005GAGP 数据手册

  
            
            
                    
                    
CALIFORNIA MICRO DEVICES  
XRN740-XXXX  
Stable Extended Capability Chip Series  
California Micro Devices Hx (Stable Extended Capability  
Chip) Series offer exceptional stability and low noise.  
Available in the standard center tapped configuration,  
they have low electro migration ꢀualities and extremely  
low TCR.  
Electrical Specifications  
Conditions  
Parameter  
TCR  
–55°C to 125°C  
100ppm  
5ppm/°C  
100Vdc  
125mw  
0.1%∆  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
TTCR  
–55°C to 125°C  
–55°C to 125°C  
Operating Voltage  
Power Rating  
Deration  
@ 70°C (Derate linearly to zero @ 150°C)  
30°C for 2 years  
Thermal Shock  
High Temperature Exposure  
Moisture Resistance  
Life  
Method 107 MIL-STD-202F  
100 Hrs @ 150°C Ambient  
Method 106 MIL-STD-202F  
0.2%∆R  
0.15%  
0.2%∆R  
0.2%∆R  
Method 108 MIL-STD-202F (125°C/1000 hr)  
Method 308 MIL-STD-202F up to 250KΩ  
≥250KΩ  
Noise  
–35dB  
–20dB  
Insulation Resistance  
@25°C  
1 X 1012  
Ω
Min  
Values  
Bonding Area  
1MΩ to 20MΩ standard. Standard ratio tolerance between  
resistors = 1%. Tighter ratio tolerance available.  
R1  
R2  
Laser Code Area  
Mechanical Specifications  
Formats  
Die Size: 45 3 mils sꢀuare  
Bonding Pads: 4x4 mils typical  
Substrate  
Isolation Layer  
Resistor  
Silicon 10 2 mils thick  
Si02 10,000Å thick, min  
Proprietary Silicon Chrome  
Lapped (gold optional)  
1 M  
Ω
to 20 M  
Ω
Backing  
Bond Pads  
Aluminum 10,000Å thick, min  
Notes  
1. Code boxes are available for alphanumeric laser  
marking on the chip.  
Packaging  
Two inch square trays of 400 chips maximum is standard.  
2. Resistor pattern may vary from one value to another.  
Part Number Designation  
XRN740  
1005  
F
A
G
W
P
Series Resistance Value  
First 3 digits are  
significant  
Tolerance  
TCR  
Bond Pads  
Backing  
Ratio Tolerance  
D = 0.5%  
No Letter = 100ppm  
G = Gold  
W = Gold  
Std = 1%  
value.  
Last digit  
represents  
number of  
No Letter =  
Aluminum  
F = 1%  
A = 50ppm  
L = Lapped  
P = 0.5%  
No Letter =  
Either  
G = 2%  
B = 25ppm  
zeros.  
R indicates  
decimal point.  
J = 5%  
K = 10%  
© 2000 California Micro Devices Corp. All rights reserved.  
C1360800  
8/9/2000  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
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