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XRAG2-W41/1GE PDF预览

XRAG2-W41/1GE

更新时间: 2024-11-25 15:58:31
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 电信电信集成电路
页数 文件大小 规格书
32页 320K
描述
SPECIALTY TELECOM CIRCUIT, UUC, WAFER

XRAG2-W41/1GE 技术参数

生命周期:Obsolete零件包装代码:WAFER
包装说明:DIE,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.84
Is Samacsys:NJESD-30 代码:X-XUUC-N
功能数量:1最高工作温度:55 °C
最低工作温度:-20 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:UNSPECIFIED
封装形式:UNCASED CHIP认证状态:Not Qualified
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:OTHER端子形式:NO LEAD
端子位置:UPPERBase Number Matches:1

XRAG2-W41/1GE 数据手册

 浏览型号XRAG2-W41/1GE的Datasheet PDF文件第2页浏览型号XRAG2-W41/1GE的Datasheet PDF文件第3页浏览型号XRAG2-W41/1GE的Datasheet PDF文件第4页浏览型号XRAG2-W41/1GE的Datasheet PDF文件第5页浏览型号XRAG2-W41/1GE的Datasheet PDF文件第6页浏览型号XRAG2-W41/1GE的Datasheet PDF文件第7页 
XRAG2  
432-bit UHF, EPCglobal Class1 Generation2 and ISO 18000-6C,  
contactless memory chip with user memory  
Features  
EPCglobal class 1 generation 2 RFID UHF  
specification (revision 1.0.9)  
Passive operation (no battery required)  
UHF carrier frequencies from 860 MHz to  
960 MHz ISM band  
To the XRAG2:  
– Asynchronous 90% SSB-ASK, DSB-ASK  
or PR-ASK modulation using pulse interval  
encoding (Up to 128Kbit/s)  
Unsawn unbumped wafers  
or  
sawn and bumped wafers  
From the XRAG2:  
– Backscattered reflective answers using  
FM0 or Miller bit coding (up to 640 Kbits/s)  
432-bit memory with two possible  
configurations:  
– 3 memory banks to store up to 256-bit EPC  
code: 64-bit TID, 304-bit EPC and 64-bit  
reserved banks  
– 4 memory banks to store up to 128-EPC  
code: 128-bit user, 64-bit TID, 176-bit EPC  
and 64-bit reserved banks  
Supports EPC and ISO TID  
Multisession protocol  
Anti-collision functionality  
Inventory, Read, Write and Erase features  
Kill command  
100 ms programming time (max) for 288-bit  
(EPC code, Protocol Control bits and CRC16)  
programming  
More than 10,000 Write/Erase cycles  
More than 40 years’ data retention  
November 2007  
Rev 5  
1/32  
www.st.com  
1

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