Datasheet > XH3B-013P-D5F

XH3B-013P-D5F

更新时间： 2024-09-21 20:46:03

品牌	Logo	应用领域
欧姆龙 - OMRON		连接器
页数	文件大小	规格书
6页	274K
描述
Board Stacking Connector

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

XH3B-013P-D5F 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8536.69.40.40	风险等级：	5.84
连接器类型：	BOARD STACKING CONNECTOR	联系完成配合：	GOLD (6)
联系完成终止：	GOLD FLASH	触点材料：	COPPER ALLOY
JESD-609代码：	e4	Base Number Matches：	1

XH3B-013P-D5F 数据手册

Half-pitch Fine-fit and Stacking Connectors

XH3

Half-pitch Fine-fit Connectors Achieve

High-density Mounting without

Soldering

■ Solderless connection eliminates soldering and

washing processes.

■ Multi-level stacking conserves board space.

■ Requires half the space of conventional DIN con-

nectors (OMRON’s XC5B).

■ At a stacking height of 16.8 mm, the XH3 can be

stacked together with DIN connectors.

■ Mates with conventional XH3-series Half-pitch

Connectors.

(See the Mating Diagram on page 4.)

■ Allows press fitting using commercial tools.

RoHS Compliant

■Terminology

Ordering Information

■Ratings and Characteristics

• Fine-fit

Refers to a press-fit connection using Omron's own ter-

minal shape.

Rated current

Rated voltage

0.5 A

125 VAC

• Solderless connection

Contact resistance (See note.) 40 mΩ max. (at 20 mV, 100 mA max.)

Refers to a solderless electric connection of a connec-

tor, electric cable and printed circuit board. It involves

crimping, IDC pressing, press-fitting (fine-fit), etc. A

solderless connection generally refers to a press-fit con-

nection.

Insulation resistance

Dielectric strength

Total insertion force

Total removal force

Insertion durability

1,000 MΩ min. (at 500 VDC)

650 VAC for 1 min (leakage current: 1 mA max.)

0.78 N max. per contact

0.05 N min. per contact

50 times

• Stacking

Ambient operating temperature Operating: −55 to 105°C (with no icing)

Connects the printed-wiring boards parallel to each other.

The distance between the boards here is called "stack-

ing height".

Note: The contact resistance is for the XH3B-013P-D32 com-

bined with the XH3B-013P-D5F (with the XH3B-013P-

D32 terminal used as the plug).

■Materials and Finish

Con-

nector

Housing

Locator

PBT resin with glass (UL94V-0)/gray

Polyester elastomer (UL94V-0)/black

Con-

tacts

Socket

Copper alloy/nickel base,

0.15-µm gold plating

Short terminal Copper alloy/nickel base,

gold flash plating

Backplane ter- Copper alloy/nickel base,

minal

0.15-µm gold plating

Backplane connector housing/

PBT resin with glass

short terminal connector rear cover (UL94V-0)/gray

■Applicable Fine-fit PCBs

PCB thickness

1.6 mm

Through Finished di-

0.5±0.05 mm diameter (drill bit diame-

ter 0.55+0.05 mm)

holes

ameter

Plating speci- 5 µm min. solder with 25 µm min. cop-

fications

per base

PCB materials

Glass-epoxy board

12 3 4 5 6

中文翻译

下载PDF

与XH3B-013P-D5F相关器件

型号	品牌	获取价格	描述	数据表
XH3B-0141	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0141-1A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0141-3A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0141-4A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0141-A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0142-A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0241	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0241-1A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0241-3A	OMRON	获取价格	Half-pitch Board-to-Board Connectors
XH3B-0241-4A	OMRON	获取价格	Half-pitch Board-to-Board Connectors

与XH3B-013P-D5F相关文章

摩尔斯微电子在美国约书亚树国家公园测试 Wi-Fi HaLow
2024-09-18

64
贸泽上架Tallysman TW5386智能GNSS天线
2024-09-18

61
SL74HC10N：高性能三输入与非门解析
2024-09-03

133
AIC1781A 电池充电控制器深度解析
2024-09-03

130

产品中心

服务支持

精选活动

关于我们

帮助中心

XH3B-013P-D5F

XH3B-013P-D5F 技术参数

XH3B-013P-D5F 数据手册

与XH3B-013P-D5F相关器件

与XH3B-013P-D5F相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

XH3B-013P-D5F

XH3B-013P-D5F 技术参数

XH3B-013P-D5F 数据手册

与XH3B-013P-D5F相关器件

与XH3B-013P-D5F相关文章

您还可以找

您在本页遇到什么问题？