Datasheet > XC7WT14DP,125

XC7WT14DP,125

更新时间： 2024-01-20 19:10:09

品牌	Logo	应用领域
恩智浦 - NXP		光电二极管逻辑集成电路
页数	文件大小	规格书
18页	203K
描述
XC7WT14 - Triple inverting Schmitt trigger TSSOP 8-Pin

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技术参数
数据手册

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XC7WT14DP,125 技术参数

Source Url Status Check Date：	2013-06-14 00:00:00	是否Rohs认证：	符合
生命周期：	Transferred	零件包装代码：	TSSOP
包装说明：	3 MM, PLASTIC, SOT505-2, TSSOP-8	针数：	8
Reach Compliance Code：	compliant	风险等级：	5.77
Base Number Matches：	1

XC7WT14DP,125 数据手册

XC7WT14

Triple inverting Schmitt trigger

Rev. 3 — 23 January 2013

Product data sheet

1. General description

The XC7WT14 is a high-speed Si-gate CMOS device. This device provides three inverting

buffers with Schmitt trigger action. This device is capable of transforming slowly changing

input signals into sharply defined, jitter-free output signals.

2. Features and benefits

 Symmetrical output impedance

 High noise immunity

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 CDM JESD22-C101D exceeds 1000 V

 Low power dissipation

 Balanced propagation delays

 Multiple package options

 Specified from 40 C to +85 C and 40 C to +125 C

3. Applications

 Wave and pulse shaper for highly noisy environment

 Astable multivibrator

 Monostable multivibrator

4. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

XC7WT14DP

XC7WT14DC

XC7WT14GT

XC7WT14GD

40 C to +125 C

TSSOP8

VSSOP8

XSON8

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

plastic extremely thin small outline package; no leads; SOT833-1

8 terminals; body 1  1.95  0.5 mm

plastic extremely thin small outline package; no leads; SOT996-2

8 terminals; body 3  2  0.5 mm

12 3 4 5 6 7...18

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