Datasheet > XB1008-BD_10

XB1008-BD_10

更新时间： 2022-09-11 09:47:30

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MIMIX		/
页数	文件大小	规格书
5页	1273K
描述
10.0-21.0 GHz GaAs MMIC

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XB1008-BD_10 数据手册

10.0-21.0 GHz GaAs MMIC

Buffer Amplifier

November 2010 - Rev 11-Nov-10

B1008-BD

Mechanical Drawing

0.355

0.955

(0.014)

(0.038)

1.100

(0.043)

0.310

(0.012)

0.310

(0.012)

0.0

0.560

(0.022)

1.100

(0.043)

0.0

(Note: Engineering designator is 15MPA0857)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 0.75 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vg1)

Bond Pad #3 (Vd)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg2)

Bias Arrangement

Vg1

Bypass Capacitors - See App Note [2]

RF In

RF Out

Vg2

Page 3 of 5

Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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