Datasheet > XB1008-BD

XB1008-BD

更新时间： 2023-12-06 20:09:08

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
7页	671K
描述
Buffer Amp

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XB1008-BD 数据手册

XB1008-BD

Buffer Amplifier

10.0-21.0 GHz

Rev. V1

Mechanical Drawing

0.355

0.955

(0.014)

(0.038)

1.100

(0.043)

0.310

(0.012)

0.310

(0.012)

0.0

0.560

(0.022)

1.100

(0.043)

0.0

(Note:Engineering designator is15MPA0857)

Units:millimeters(inches)Bond pad dimensionsareshown to center of bond pad.

Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backsideisground,Bond Pad/BacksideMetallization:Gold

All DCBond Pads(except Vd3)are0.100 x 0.100 (0.004 x 0.004).All RFBond Pads(and Vd3)are0.100 x 0.200 (0.004 x 0.008)

Bond pad centersareapproximately 0.109(0.004)from theedgeof thechip.

Dicing tolerance:+/- 0.005(+/- 0.0002).Approximateweight:0.75 mg.

Bond Pad #1(RFIn)

Bond Pad #2(Vg1)

Bond Pad #3 (Vd)

Bond Pad #4 (RFOut)

Bond Pad #5 (Vg2)

Bias Arrangement

Vg1

Bypass Capacitors - See App Note [2]

RF In

RF Out

Vg2

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

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