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XAM1808AZCE4 PDF预览

XAM1808AZCE4

更新时间: 2024-11-24 07:06:35
品牌 Logo 应用领域
德州仪器 - TI 微处理器
页数 文件大小 规格书
264页 1764K
描述
AM1808 ARM Microprocessor

XAM1808AZCE4 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA,针数:361
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.81
其他特性:IT ALSO OPERATES AT 1.8V AND 3.3V地址总线宽度:23
位大小:32边界扫描:YES
最大时钟频率:50 MHz外部数据总线宽度:16
格式:FIXED POINT集成缓存:YES
JESD-30 代码:S-PBGA-B361长度:13 mm
低功率模式:YES端子数量:361
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
认证状态:Not Qualified座面最大高度:1.3 mm
速度:456 MHz最大供电电压:1.35 V
最小供电电压:1.25 V标称供电电压:1.3 V
表面贴装:YES技术:CMOS
端子形式:BALL端子节距:0.65 mm
端子位置:BOTTOM宽度:13 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC

XAM1808AZCE4 数据手册

 浏览型号XAM1808AZCE4的Datasheet PDF文件第2页浏览型号XAM1808AZCE4的Datasheet PDF文件第3页浏览型号XAM1808AZCE4的Datasheet PDF文件第4页浏览型号XAM1808AZCE4的Datasheet PDF文件第5页浏览型号XAM1808AZCE4的Datasheet PDF文件第6页浏览型号XAM1808AZCE4的Datasheet PDF文件第7页 
AM1808  
www.ti.com  
SPRS653FEBRUARY 2010  
AM1808 ARM Microprocessor  
Check for Samples: AM1808  
1 AM1808 ARM Microprocessor  
1.1 Features  
12  
Interfaces  
• 375/456-MHz ARM926EJ-S™ RISC MPU  
• ARM926EJ-S Core  
• Two Master/Slave Inter-Integrated Circuit (I2C  
Bus™)  
– 32-Bit and 16-Bit (Thumb®) Instructions  
– Single Cycle MAC  
• One Host-Port Interface (HPI) With 16-Bit-Wide  
Muxed Address/Data Bus For High Bandwidth  
• Programmable Real-Time Unit Subsystem  
(PRUSS)  
– ARM® Jazelle® Technology  
– EmbeddedICE-RT™ for Real-Time Debug  
• ARM9 Memory Architecture  
– 16K-Byte Instruction Cache  
– 16K-Byte Data Cache  
– 8K-Byte RAM (Vector Table)  
– 64K-Byte ROM  
• Enhanced Direct-Memory-Access Controller 3  
(EDMA3):  
– Two Independent Programmable Realtime  
Unit (PRU) Cores  
32-Bit Load/Store RISC architecture  
4K Byte instruction RAM per core  
512 Bytes data RAM per core  
PRU Subsystem (PRUSS) can be disabled  
via software to save power  
– 2 Channel Controllers  
– 3 Transfer Controllers  
– 64 Independent DMA Channels  
– 16 Quick DMA Channels  
Register 30 of each PRU is exported from  
the subsystem in addition to the normal  
R31 output of the PRU cores.  
– Standard power management mechanism  
– Programmable Transfer Burst Size  
• 128K-Byte On-chip Memory  
• 1.8V or 3.3V LVCMOS IOs (except for USB and  
DDR2 interfaces)  
Clock gating  
Entire subsystem under a single PSC  
clock gating domain  
– Dedicated interrupt controller  
• Two External Memory Interfaces:  
– EMIFA  
– Dedicated switched central resource  
• USB 1.1 OHCI (Host) With Integrated PHY  
(USB1)  
• USB 2.0 OTG Port With Integrated PHY (USB0)  
– USB 2.0 High-/Full-Speed Client  
– USB 2.0 High-/Full-/Low-Speed Host  
– End Point 0 (Control)  
NOR (8-/16-Bit-Wide Data)  
NAND (8-/16-Bit-Wide Data)  
16-Bit SDRAM With 128 MB Address  
Space  
– DDR2/Mobile DDR Memory Controller  
16-Bit DDR2 SDRAM With 512 MB  
Address Space or  
– End Points 1,2,3,4 (Control, Bulk, Interrupt or  
ISOC) Rx and Tx  
16-Bit mDDR SDRAM With 256 MB  
Address Space  
• One Multichannel Audio Serial Port:  
– Transmit/Receive Clocks  
• Three Configurable 16550 type UART Modules:  
– With Modem Control Signals  
– 16-byte FIFO  
– Two Clock Zones and 16 Serial Data Pins  
– Supports TDM, I2S, and Similar Formats  
– DIT-Capable  
– 16x or 13x Oversampling Option  
• LCD Controller  
• Two Serial Peripheral Interfaces (SPI) Each  
With Multiple Chip-Selects  
• Two Multimedia Card (MMC)/Secure Digital (SD)  
Card Interface with Secure Data I/O (SDIO)  
– FIFO buffers for Transmit and Receive  
• Two Multichannel Buffered Serial Ports:  
– Transmit/Receive Clocks  
– Two Clock Zones and 16 Serial Data Pins  
– Supports TDM, I2S, and Similar Formats  
– AC97 Audio Codec Interface  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
ARM926EJ-S is a trademark of ARM Limited.  
ADVANCE INFORMATION concerns new products in the sampling  
or preproduction phase of development. Characteristic data and other  
specifications are subject to change without notice.  
Copyright © 2010, Texas Instruments Incorporated  
 
 

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