Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
Table 4: DC Characteristics Over Recommended Operating Conditions
Symbol
VDRINT
VDRAUX
Description
Min
0.8
Typ
–
Max Units
Data retention VCCINT voltage (below which configuration data might be lost)
Data retention VCCAUX voltage (below which configuration data might be lost)
VREF leakage current per pin for commercial (C) and industrial (I) devices
VREF leakage current per pin for expanded (Q) devices
–
V
2.0
–
–
V
–10
–15
–
10
15
10
µA
µA
µA
IREF
–
Input or output leakage current per pin (sample-tested) for commercial (C) and industrial –10
(I) devices
–
IL
Input or output leakage current per pin (sample-tested) for expanded (Q) devices
–15
–20
–
–
15
20
µA
µA
All pins except PROGRAM_B, DONE, and
JTAG pins when HSWAPEN = 1
Leakage current on pins during hot
IHS
socketing with FPGA unpowered
PROGRAM_B, DONE, and JTAG pins, or other
IHS + IRPU
µA
pins when HSWAPEN = 0
(1)
CIN
Die input capacitance at the pad
–
200
120
60
40
12
200
140
–
–
–
10
500
350
200
150
100
550
400
150
–
pF
µA
µA
µA
µA
µA
µA
µA
nA
Pad pull-up (when selected) @ VIN = 0V, VCCO = 3.3V or VCCAUX = 3.3V
Pad pull-up (when selected) @ VIN = 0V, VCCO = 2.5V or VCCAUX = 2.5V
Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.8V
Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.5V
Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.2V
Pad pull-down (when selected) @ VIN = VCCO, VCCAUX = 3.3V
Pad pull-down (when selected) @ VIN = VCCO, VCCAUX = 2.5V
Battery supply current
–
IRPU
–
–
–
–
IRPD
–
(2)
IBATT
–
(3)
RDT
Resistance of optional input differential termination circuit, VCCAUX = 3.3V
–
100
25
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_25) for commercial (C) and industrial (I) devices
23
55
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_25) for expanded (Q) devices
20
39
32
56
47
25
50
50
75
75
55
72
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_50) for commercial (C) and industrial (I) devices
(5)
RIN_TERM
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_50) for expanded (Q) devices
74
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_75) for commercial (C) and industrial (I) devices
109
115
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_75) for expanded (Q) devices
Thevenin equivalent resistance of programmable output termination (UNTUNED_25)
11
21
29
25
50
75
52
96
ROUT_TERM Thevenin equivalent resistance of programmable output termination (UNTUNED_50)
Thevenin equivalent resistance of programmable output termination (UNTUNED_75)
145
Notes:
1. The C measurement represents the die capacitance at the pad, not including the package.
IN
2. Maximum value specified for worst case process at 25°C. LX75, LX75T, LX100, LX100T, LX150, and LX150T only.
3. Refer to IBIS models for R variation and for values at V = 2.5V. IBIS values for R are valid for all temperature ranges.
DT
CCAUX
DT
4.
V
is not required for data retention. The minimum V
for power-on reset and configuration is 1.65V.
CCO2
CCO2
5. Termination resistance to a V
/2 level.
CCO
DS162 (v3.0) October 17, 2011
www.xilinx.com
Product Specification
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