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X22C12DMB PDF预览

X22C12DMB

更新时间: 2024-09-24 22:11:39
品牌 Logo 应用领域
XICOR 存储内存集成电路静态存储器可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
12页 62K
描述
Nonvolatile Static RAM

X22C12DMB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:0.300 INCH, HERMETIC SEALED, CERDIP-18Reach Compliance Code:unknown
风险等级:5.85Is Samacsys:N
最长访问时间:150 ns其他特性:EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES
JESD-30 代码:R-GDIP-T18JESD-609代码:e0
内存密度:1024 bit内存集成电路类型:NON-VOLATILE SRAM
内存宽度:4功能数量:1
端口数量:1端子数量:18
字数:256 words字数代码:256
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:256X4
输出特性:3-STATE可输出:NO
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DIP
封装等效代码:DIP18,.3封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
筛选级别:MIL-STD-883座面最大高度:5.08 mm
子类别:SRAMs最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

X22C12DMB 数据手册

 浏览型号X22C12DMB的Datasheet PDF文件第2页浏览型号X22C12DMB的Datasheet PDF文件第3页浏览型号X22C12DMB的Datasheet PDF文件第4页浏览型号X22C12DMB的Datasheet PDF文件第5页浏览型号X22C12DMB的Datasheet PDF文件第6页浏览型号X22C12DMB的Datasheet PDF文件第7页 
1K Bit  
X22C12  
256 x 4  
Nonvolatile Static RAM  
FEATURES  
DESCRIPTION  
High Performance CMOS  
The X22C12 is a 256 x 4 CMOS NOVRAM featuring a  
high-speed static RAM overlaid bit-for-bit with a non-  
volatile E2PROM. The NOVRAM design allows data to  
be easily transferred from RAM to E2PROM (STORE)  
and from E2PROM to RAM (RECALL). The STORE  
operation is completed within 5ms or less and the  
RECALL is completed within 1µs.  
—150ns RAM Access Time  
High Reliability  
—Store Cycles: 1,000,000  
—Data Retention: 100 Years  
Low Power Consumption  
—Active: 40mA Max.  
—Standby: 100µA Max.  
XicorNOVRAMsaredesignedforunlimitedwriteopera-  
tions to the RAM, either RECALLs from E2PROM or  
writes from the host. The X22C12 will reliably endure  
1,000,000 STORE cycles. Inherent data retention is  
greater than 100 years.  
Infinite Array Recall, RAM Read and Write Cycles  
Nonvolatile Store Inhibit: VCC = 3.5V Typical  
Fully TTL and CMOS Compatible  
JEDEC Standard 18-Pin 300-mil DIP  
100% Compatible with X2212  
—With Timing Enhancements  
FUNCTIONAL DIAGRAM  
PIN CONFIGURATION  
PLASTIC DIP  
CERDIP  
2
NONVOLATILE E PROM  
MEMORY ARRAY  
A
A
A
A
A
A
1
2
3
4
5
6
7
8
9
18  
17  
16  
15  
14  
13  
12  
11  
10  
V
A
A
7
4
3
2
1
0
CC  
6
STORE  
A
0
A
ARRAY  
RECALL  
1
5
ROW  
SELECT  
STATIC RAM  
MEMORY ARRAY  
A
A
A
I/O  
I/O  
I/O  
I/0  
2
3
4
4
3
2
X22C12  
CS  
1
V
CC  
V
WE  
STORE  
RECALL  
CONTROL  
LOGIC  
SS  
STORE  
V
SS  
RECALL  
COLUMN  
I/O CIRCUITS  
3817 FHD F02  
I/O  
1
COLUMN SELECT  
INPUT  
DATA  
I/O  
2
SOIC  
CONTROL  
I/O  
3
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
V
A7  
A
4
A
3
A
2
A
1
A
0
CC  
A
6
A
5
I/O  
4
A
A
A
5
7
6
I/O  
4
X22C12  
NC  
NC  
I/O  
3
I/O  
2
I/O  
1
CS  
CS  
V
SS  
WE  
STORE  
WE  
RECALL  
3817 FHD F01  
3815 FHD F10.1  
© Xicor, Inc. 1991, 1995 Patents Pending  
3817-2.4 7/30/96 T0/C0/D1 SH  
Characteristics subject to change without notice  
1

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