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X1286A8 PDF预览

X1286A8

更新时间: 2024-02-17 11:28:49
品牌 Logo 应用领域
英特矽尔 - INTERSIL 监控可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
页数 文件大小 规格书
25页 362K
描述
Intersil Real Time Clock/Calendar/CPU Supervisor with EEPROM X1286

X1286A8 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:SOP, SOP8,.3
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.69最大时钟频率:0.032 MHz
信息访问方法:I2C中断能力:Y
JESD-30 代码:R-PDSO-G8长度:5.255 mm
端子数量:8计时器数量:1
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.3封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/5 V认证状态:Not Qualified
座面最大高度:2.03 mm子类别:Timer or RTC
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL最短时间:1/100 SECOND
处于峰值回流温度下的最长时间:NOT SPECIFIED易失性:NO
宽度:5.23 mmuPs/uCs/外围集成电路类型:TIMER, REAL TIME CLOCK
Base Number Matches:1

X1286A8 数据手册

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X1286  
A final application for the ATR control is in-circuit cali-  
bration for high accuracy applications, along with a  
temperature sensor chip. Once the RTC circuit is pow-  
ered up with battery backup, the PHZ output is set at  
32.768kHz and frequency drift is measured. The ATR  
control is then adjusted to a setting which minimizes  
drift. Once adjusted at a particular temperature, it is  
possible to adjust at other discrete temperatures for  
minimal overall drift, and store the resulting settings in  
the EEPROM. Extremely low overall temperature drift  
is possible with this method. The Intersil evaluation  
board contains the circuitry necessary to implement  
this control.  
frequency, noise can couple to the X1 or X2 pins and  
cause double-clocking. The layout in figure 15 can  
help minimize this by running the PHZ output away  
from the X1 and X2 pins. Also, minimizing the switch-  
ing current at this pin by careful selection of the pullup  
resistor value will reduce noise. Intersil suggests a  
minimum value of 5.1k for 32.768kHz, and higher val-  
ues (i.e. 20k) for lower frequency PHZ outputs.  
For other RTC products, the same rules stated above  
should be observed, but adjusted slightly since the  
packages and pinouts are slightly different.  
Assembly  
For more detailed operation see Intersil’s application  
note AN154 on Intersil’s website at www.Intersil.com.  
Most electronic circuits do not have to deal with  
assembly issues, but with the RTC devices assembly  
includes insertion or soldering of a live battery into an  
unpowered circuit. If a socket is soldered to the board,  
and a battery is inserted in final assembly, then there  
are no issues with operation of the RTC. If the battery  
is soldered to the board directly, then the RTC device  
Vback pin will see some transient upset from either  
soldering tools or intermittent battery connections  
which can stop the circuit from oscillating. Once the  
battery is soldered to the board, the only way to assure  
the circuit will start up is to momentarily (very short  
period of time!) short the Vback pin to ground and the  
circuit will begin to oscillate.  
Layout Considerations  
The crystal input at X1 has a very high impedance and  
will pick up high frequency signals from other circuits on  
the board. Since the X2 pin is tied to the other side of  
the crystal, it is also a sensitive node. These signals can  
couple into the oscillator circuit and produce double  
clocking or mis-clocking, seriously affecting the accu-  
racy of the RTC. Care needs to be taken in layout of the  
RTC circuit to avoid noise pickup. Below in Figure 15 is  
a suggested layout for the X1286 or X1288 devices.  
Figure 15. Suggested Layout for Intersil RTC in SO-8  
Oscillator Measurements  
C1  
When a proper crystal is selected and the layout guide-  
lines above are observed, the oscillator should start up  
in most circuits in less than one second. Some circuits  
may take slightly longer, but startup should definitely  
occur in less than 5 seconds. When testing RTC cir-  
cuits, the most common impulse is to apply a scope  
probe to the circuit at the X2 pin (oscillator output) and  
observe the waveform. DO NOT DO THIS! Although in  
some cases you may see a useable waveform, due to  
the parasitics (usually 10pF to ground) applied with the  
scope probe, there will be no useful information in that  
waveform other than the fact that the circuit is oscillat-  
ing. The X2 output is sensitive to capacitive impedance  
so the voltage levels and the frequency will be affected  
by the parasitic elements in the scope probe. Applying a  
scope probe can possibly cause a faulty oscillator to  
start up, hiding other issues (although in the Intersil  
RTC’s, the internal circuitry assures startup when using  
the proper crystal and layout).  
0.1µF  
R1 10k  
U1  
XTAL1  
X1286/X1288  
32.768kGz  
The X1 and X2 connections to the crystal are to be  
kept as short as possible. A thick ground trace around  
the crystal is advised to minimize noise intrusion, but  
ground near the X1 and X2 pins should be avoided as  
it will add to the load capacitance at those pins. Keep  
in mind these guidelines for other PCB layers in the  
vicinity of the RTC device. A small decoupling capaci-  
tor at the Vcc pin of the chip is mandatory, with a solid  
connection to ground.  
The best way to analyze the RTC circuit is to power it  
up and read the real time clock as time advances, or if  
the chip has the PHZ output, look at the output of that  
pin on an oscilloscope (after enabling it with the con-  
trol register, and using a pullup resistor for an open-  
drain output). Alternatively, the X1226/X1286/1288  
The X1286 product has a special consideration. The  
PHZ/IRQ- pin on the 8-lead SOIC package is located  
next to the X2 pin. When this pin is used as a fre-  
quency output (PHZ) and is set to 32.768kHz output  
FN8101.0  
21  
March 29, 2005  

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