Approval sheet
Un-mounted chips completely immersed for 2±0.5 second in a
SAC solder bath at 235℃±5℃
good tinning (>95% covered)
no visible damage
Solderability
IEC 60068-2-58: 2004
no visible damage
Temperature cycling
30 minutes at -55C3C, 2~3 minutes at 20°C+5°C-1°C, 30
minutes at +155C3C, 2~3 minutes at 20°C+5°C-1°C, total 5
continuous cycles
Clause 4.19
R/R max. ±(1%+0.0001)
1000 +48/-0 hours, loaded with RCWC or max. operation current no visible damage
Load life (endurance)
in chamber controller 70±2ºC, 1.5 hours on and 0.5 hours off
Clause 4.25
R/R max. ±(5%+0.0001)
no visible damage
1000 +48/-0 hours, no load at 155±2ºC,
Endurance at upper
temperature
R/R max. ±(5%+0.0001)
no visible damage
Load life in Humidity
1000 +48/-0 hours, no loaded at 40C2C and 90~95% relative
humidity.
Clause 4.24
R/R max. (5%+0.0001)
Pressurizing force: 5N, Test time: 10±1sec.
Adhesion
No remarkable damage or
removal of the terminations
Clause 4.32
Page 7 of 8
ASC_WW25R_V11
Nov -2023