Datasheet > WW25BR020FTLJ

WW25BR020FTLJ

更新时间： 2024-04-09 18:57:50

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	476K
描述
2512(6432), 0.020Ω, ±1%, 3W

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WW25BR020FTLJ 数据手册

Approval sheet

TEST AND REQUIREMENTS ( AEC Q-200 )

REQUIREMENT

Resistor

TEST

PROCEDURE / TEST METHOD

Within the specified tolerance Refer to

“QUICK REFERENCE DATA”

Electrical Characteristics - DC resistance values measurement

- Temperature Coefficient of Resistance (T.C.R)

Natural resistance change per change in degree centigrade.

JISC5201-1: 1998

Clause 4.8

R₂ R

₁t₂t₁

10⁶(ppm/C) t₁: 20°C+5°C-1°C

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

J: ΔR/R max. (1.0%+0.5m)

F: ΔR/R max. (0.5%+0.5m)

no visible damage

Un-mounted chips completely immersed for 10±1second in a

SAC solder bath at 270℃±5ºC

Resistance to soldering

heat (R.S.H)

MIL-STD-202

method 210

a) Bake the sample for 155℃ dwell time 4hrs/ solder dipping

235℃/ 5sec.

b) Steam the sample dwell time 8 hour/ solder dipping 215℃/

Solderability

AEC Q-200

95% coverage min., good tinning and no

visible damage

5sec.

c) Steam the sample dwell time 8 hour/ solder dipping 260℃/

7sec.

J: ΔR/R max. (1.0%+1m)

F: ΔR/R max. (0.5%+1m)

No visible damage

1000 cycles, -55℃ ~ +125℃, dwell time 30min maximum.

Temperature cycling

AEC Q-200 7.4

J: ΔR/R max. (1.0%+0.5m)

F: ΔR/R max. (0.5%+0.5m)

No visible damage

Moisture Resistance

MIL-STD-202

652C, 80~100% RH, 10 cycles, 24 hours/ cycle

method 106

J: ΔR/R max. (3.0%+0.5m)

F: ΔR/R max. (1.0%+0.5m)

1000+48/-0 hours; 85C, 85% RH, 10% of operation power

Bias Humidity

MIL-STD-202

method 103

No visible damage

J: ΔR/R max. (3.0%+0.5m)

F: ΔR/R max. (1.0%+0.5m)

No visible damage

Operational Life

MIL-STD-202

method 108

High Temperature

Exposure

1000+48/-0 hours; specified rated power at 1252C

J: ΔR/R max. (3.0%+0.5m)

F: ΔR/R max. (1.0%+0.5m)

No visible damage

1000+48/-0 hours; without load in a temperature chamber

controlled 1253C

MIL-STD-202

Method 108

Board Flex

J: ΔR/R max. (1.0%+1m)

F: ΔR/R max. (0.5%+1m)

No visible damage

Resistors mounted on

90mm glass epoxy resin

AEC-Q200-005

PCB(FR4),bending once 2mm for 60sec.

No remarkable damage or removal of

the terminations

Terminal strength

Pressurizing force: 1Kg, Test time: 60±1sec.

AEC-Q200-006

J: ΔR/R max. (1.0%+0.5m)

F: ΔR/R max. (0.5%+0.5m)

Thermal shock

MIL-STD-202

method 107

Test –55 to 155℃/ dwell time 15min/ Max transfer time

20sec 300cycles

No visible damage

Page 6 of 8

ASC_WW25B_J_AUTO_V04

JUN 2020

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